The ASMPT ALSI LASER1205 laser dicing machine is an advanced semiconductor wafer separation system designed for high-precision laser dicing and wafer grooving applications.
ASMPT LASER1205 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Fully automatic semiconductor laser dicing and grooving system |
| Manufacturer | ASMPT ALSI |
| Model | LASER1205 |
| Processing Technology | Multi-beam laser dicing / laser grooving |
| Laser Configuration | UV / IR / UV-USP |
| Position Accuracy | Below 1.5 μm |
| Typical Kerf Width | Below 12 μm |
| Heat Affected Zone | Low thermal impact laser processing |
| Supported Materials | Silicon, SiC, GaAs, Ge, DAF, Mold materials |
| Main Applications | Wafer dicing, wafer grooving, semiconductor singulation |
The exact configuration depends on laser type, material requirements, and customer production process.
Refurbished ASMPT LASER1205 Equipment Evaluation Guide
The semiconductor equipment second-hand market has increasing demand for laser dicing systems due to their high investment cost.
Before purchasing a refurbished LASER1205 system, engineers should confirm the following points:
| Inspection Item | Important Check |
|---|---|
| Laser System | Laser output stability and lifetime |
| Optical System | Lens condition and alignment accuracy |
| Motion System | X/Y/Z axis accuracy |
| Vision System | Camera calibration and recognition performance |
| Process Data | Previous wafer material and production history |
| Software | Recipe availability and system compatibility |
