Precise gas delivery is critical for stable operation on your ASM die bonder. The 02-15467/CQ bubbler mass flow module controls vapor and gas flow accurately during semiconductor die attach processes.
A faulty flow module leads to inconsistent gas concentration and unstable bonding conditions. Replacing it restores gas flow control accuracy and prevents batch product defects.
Add this module to your spare inventory. Protect your die bonding process window and maintain consistent packaging yield.
Product Information
| Product Name | ASM 02-15467/CQ Bubbler Mass Flow Module |
| Part Number | 02-15467 / 02-15467-CQ |
| Equipment Brand | ASM |
| Related Reference | 03-21127 / HiPec Motion Board references in public listings |
| Product Category | Die Bonder Control Module / Bubbler Mass Flow Control Module |
| Equipment Application | ASM Die Bonder Parts |
| Condition | New |
| Availability | In Stock |
| Warranty Support | Available according to product and supply details |
| Price Policy | Based on quantity and purchasing requirements |
