Used ASM AD50Pro Die Bonder | 50 ms Small-Die System

This pre-owned ASM AD50Pro die bonder is suited for production environments that demand high-speed throughput and frequent product changeovers. The platform’s core strength lies in its 50-millisecond placement speed; this ensures high productivity while maintaining the precision required for handling miniature semiconductor dies, thereby overcoming the common trade-off between speed and yield stability found in many traditional bonders. It enables packaging companies to scale up capacity for established small-die products while avoiding the long lead times and massive capital investment associated with brand-new equipment.

The AD50Pro Advantage for 50 ms Small-Die Production

Many die attach platforms either push speed at the cost of placement repeatability or prioritize precision and sacrifice cycle time. The AD50Pro architecture resolves this gap for small die applications by streamlining motion control, vision triggering and pick-bond sequencing to hit 50 ms per placement under typical operating conditions.

Advanced on-the-fly vision alignment removes waiting time during substrate indexing, keeping the bonding head moving continuously across leadframe or panel substrates. This design is especially valuable for packages with dense die arrays, such as SOT, SC70, DFN and mini power discrete devices. Even when running ultra-small die, the system maintains stable pick control, reducing chipping and pick misses that erode overall line yield.

Integrated process sensing monitors bond force, placement offset and material deposition in real time. Process engineers can capture run data to tune recipes quickly, which is a major benefit for contract packaging sites managing multiple device lots across a single shift.

Refurbishment & Machine Condition

Our ASM AD50Pro unit undergoes end-to-end inspection focused on the assemblies most likely to impact small-die throughput and yield. Technicians fully audit the high-speed bonding head, pick tooling, vision recognition system, substrate transport stage and motion drive components. Wear components are assessed and replaced as needed before final qualification.

Every unit completes full dry cycle testing and actual small-die bonding validation to verify its 50 ms placement performance, positioning accuracy and pick reliability. All test logs are retained and available for your engineering team to review before shipment.

As pre-owned equipment, it does not carry original OEM warranty. We provide over 1 year of after-sales maintenance service, covering technical troubleshooting, remote support and parts consultation to lower risk during line integration. Optional add-ons include remote commissioning guidance and on-site operator training to speed up production ramp-up.

Core Process Capabilities