The ASM AD50Pro is a high-speed automatic die bonder developed for repetitive small-die placement in volume production. Published data lists a nominal 50 ms bonding cycle, ±25 μm XY placement accuracy and die handling down to 3 mil under specified conditions.
These figures describe the original platform rather than the present performance of every used AD50Pro. Actual output and small-die capability depend on the installed wafer system, material handler, vision setup, tooling and machine condition.
Published ASM AD50Pro Specifications
| Specification | Published Data | Used-Machine Consideration |
|---|---|---|
| Equipment Type | Fully automatic die bonder | Confirm the installed input, bonding and output configuration. |
| Bonding Cycle | 50 ms | This is a nominal cycle, not guaranteed finished production output. |
| XY Placement Accuracy | ±25 μm @ 3σ | Verify camera condition, calibration and placement repeatability. |
| Die Rotation Accuracy | ±3° | Confirm that the tolerance meets the intended package requirement. |
| Minimum Die Size | Down to 3 mil | Requires matching collets, ejector tools, wafer tape and pickup settings. |
| Motion System | Linear motor | Inspect encoders, guides, cables and motion stability. |
| Wafer Automation | Automatic loading and unloading available as an option | Check whether this option is installed on the available machine. |
| Machine Dimensions | Approximately 1,570 × 1,160 × 2,057 mm | Confirm the dimensions and shipping configuration of the actual unit. |
When an AD50Pro Is a Suitable Choice
A used AD50Pro may be suitable when the project requires high-speed placement of small dies and the published ±25 μm accuracy is sufficient for the product.
Small dies supplied from a compatible wafer and frame
Repetitive, high-volume die placement
Receiving material supported by the installed handler
Available collets, ejector tools and workholders match the product
Existing ASM process files or production experience can be reused
The 3 mil specification does not mean that every 3 mil die can run successfully. Die thickness, wafer tape, surface condition, vision contrast and allowable pickup area also affect handling.
What the 50 ms Cycle Means in Production
The published 50 ms figure represents a machine bonding cycle under specified conditions. It should not be converted directly into guaranteed hourly output.
Actual production also includes wafer alignment, die search, bad-die skipping, material indexing, vision inspection, loading and unloading. The most useful throughput test therefore uses the intended die, receiving material and production recipe.
A power-on or dry-cycle video confirms basic machine movement, but it does not prove 3 mil pickup or production output.
AD50Pro Placement Accuracy
With published XY placement accuracy of ±25 μm @ 3σ, the AD50Pro should be treated as a speed-oriented small-die production machine. It is not a replacement for equipment designed around several-micron optical alignment.
If the product requires approximately ±3 μm placement for optical components or multi-component alignment, compare the ASMPT AD280 Plus high-precision die bonder instead.
What to Check on a Used ASM AD50Pro
Machine nameplate, serial number and manufacturing year
Previous production application and maintenance history
Wafer size, frame, expander and ejector configuration
Input and output material-handling system
Installed collets, ejector pins and workholders
Bond-head movement, linear motors and encoder condition
Vision cameras, lighting and pattern recognition
Software version, licenses and machine backups
Known alarms, replaced parts and missing modules
Testing should be matched to the intended product whenever suitable dies, wafer frames, receiving material and tooling are available.
Used AD50Pro Availability
AD50Pro availability changes with current used-equipment inventory. Other used ASM and ASMPT die bonders can also be reviewed when the available AD50Pro does not match the required handler, tooling or placement tolerance.
Availability: Confirm against current inventory
Condition: Inspection and testing scope stated with the quotation
Price: Based on machine year, configuration, condition and included tooling
Export: International packing and shipment can be arranged
Send the die dimensions, wafer format, receiving-material drawing, placement tolerance, required output and destination through our equipment inquiry form.
