The refurbished & used ASM AD800 Automatic Die Bonder is a mature industrial-grade die attach solution for mid-volume semiconductor and optoelectronic packaging production. Targeted at factory capacity expansion, pilot production lines and contract packaging scenarios, this pre-owned equipment delivers original industrial precision and operational stability while greatly cutting down procurement and production costs compared with new machines.
Pragmatically designed for diversified packaging demands, the ASM AD800 supports both epoxy bonding and eutectic bonding processes, perfectly adapting to common substrates including lead frames, rigid PCBs and custom carrier substrates. It covers mainstream production needs of LED chips, discrete transistors, diodes, MOSFETs and miniaturized signal ICs, with strong production compatibility and flexible model switching capabilities, effectively meeting the multi-product production layout of packaging enterprises.
Fitted with high-resolution visual alignment system and optimized linear motion transmission structure, this automatic die bonder maintains outstanding placement repeatability and operational stability during long-hour continuous production. The real-time online detection function can automatically identify offset placement, missing dies and pad contamination, reducing manual inspection pressure and material waste, and stably improving production yield. All our in-stock ASM AD800 devices undergo full disassembly inspection, wearing parts replacement, system parameter calibration and 24-hour continuous aging testing, with complete test records to ensure stable and reliable factory operation.
Core Product Advantages
Strong process adaptability: Dual support of epoxy and eutectic bonding, compatible with multiple substrates and chip types
Stable mass production performance: High-precision visual positioning, low vibration operation, stable accuracy in long-cycle production
High cost performance: Refurbished to industrial standard, low failure rate and simple daily maintenance
Low investment threshold: Replace new equipment with low CAPEX, fast delivery and quick production startup
Product Parameters – Used ASM AD800 Automatic Die Bonder
Parameter Item | Technical Specification |
|---|---|
Equipment Type | Fully Automatic Die Bonder |
Applicable Bonding Process | Epoxy Bonding, Eutectic Bonding |
Applicable Chip Size | 3mil and above miniature chips |
Maximum Substrate Size | 270mm × 100mm |
Positioning Mode | High-precision CCD visual automatic alignment |
Transmission Structure | Linear motor drive, low vibration and stable operation |
Applicable Products | LED chips, discrete semiconductors, small signal ICs |
Production Feature | Real-time placement detection, automatic defect identification |
Refurbishment Standard | Full inspection, wearing parts replacement, 24h aging test, factory calibration |
Application Scenarios | Medium-volume mass production, factory capacity expansion, laboratory pilot production |
