We supply refurbished ASM AD838 fully automatic epoxy die bonders. This pre-owned equipment has undergone a comprehensive internal rebuild and testing process, making it ready for immediate use in high-density leadframe epoxy die bonding applications. The ASM AD838 is a production-proven system featuring ASM’s patented bond head architecture, integrated vision alignment, and flexible substrate handling. It supports optional dual-epoxy dispensing and accommodates leadframes up to 4 inches wide, supporting mainstream packages such as QFN, TQFP, PLCC, TSSOP, TSOP, SOIC, and SOT.
Our AD838 units undergo a standardized refurbishment process that includes mechanical overhauls, linear motion checks, vision system calibration, epoxy dispensing verification, and replacement of vacuum and nozzle systems, followed by rigorous dry-run and production simulation tests. Before shipment, the equipment is cleaned and re-certified, with a test report included. This solution mitigates the risks typically associated with used die bonding equipment, offering a cost-effective alternative for packaging manufacturers to meet medium-to-high volume production needs without the expense of purchasing new machinery.
Core Machine Highlights
Patented bond head design for stable high-speed epoxy die attach
Advanced vision alignment suite with multiple inspection algorithms
Supports dual epoxy dispensing configuration (subject to unit build)
Handles lead frames / substrates up to 4” width
Graphical multi-language HMI for fast recipe setup and changeover
Optional reel-to-reel material handling for continuous lead frame production
Built-in process monitoring and machine self-diagnostics to reduce unplanned downtime
Can integrate with downstream options: lead frame cutter or curing oven
Machine Specifications
| Item | Description |
|---|---|
| Machine Model | ASM AD838 Automatic High-Speed Epoxy Die Bonder |
| Machine Condition | Refurbished / Used, fully rebuilt & pre-tested |
| Bonding Type | Epoxy die attach (paste dispensing) |
| Supported Substrate | Lead frame, max. 4 inch width |
| Alignment System | Advanced pattern recognition vision alignment |
| Dispensing Option | Single epoxy dispense (dual dispense optional, subject to unit configuration) |
| User Interface | Multi-language graphical HMI, recipe storage & recall |
| Material Handling | Standard lead frame input; reel-to-reel available as option |
| Built-in Functions | Process monitoring, machine self-diagnosis, dry run mode |
| Supported Packages | QFN, TQFP, PLCC, TSSOP, SOIC, SOT, discrete semiconductors |
| Refurbishment Scope | Mechanical overhaul, motion parts replacement, vision calibration, vacuum & epoxy fluid path rebuild, full functional test |
| Deliverables | Test report, replaced parts list, operation manual |
Note: Throughput, die size range and cycle time vary by package type, die dimension and machine configuration. Please contact us for process-specific data upon inquiry
Refurbishment & Quality Assurance
This is not an “as-is” used machine. Our refurbishment scope covers:
Complete teardown, cleaning and inspection of all mechanical assemblies
Servo, linear stage and bond head wear part replacement
Vision camera, lighting and pattern recognition calibration
Vacuum path, ejector and nozzle holder overhaul
Epoxy dispensing pump and fluid path inspection and rebuild
Full functional test, recipe run and bonding quality verification
Documentation including test log, replaced parts list and machine manual
We can tailor the scope to match your process requirements: upgrade vision, add dual dispense, or replace spare nozzle kits as part of the package.
