The ASM AD838 is a fully automatic epoxy die bonder for semiconductor die attach. It picks separated dies from a wafer, applies epoxy to the leadframe or substrate, aligns each die with pattern recognition and completes placement automatically.
The machine is used in established IC, discrete semiconductor and LED packaging lines. Standard AD838 systems handle wafers up to 8 inches and substrates up to approximately 100 mm wide. The wafer table, material handler, epoxy system and product tooling vary between machines.
ASM AD838 Machine Information
| Manufacturer | ASM / ASMPT |
|---|---|
| Model | AD838 |
| Machine Type | Fully automatic epoxy die bonder |
| Process | Face-up epoxy die attach |
| Published Throughput | Up to 17,200 units per hour |
| Published Cycle Time | Approximately 200 ms with pattern-recognition alignment |
| X/Y Placement Accuracy | ±25 µm |
| Die Rotation Accuracy | ±1° |
| Wafer Handling | Up to 8 inches |
| Substrate Width | Up to approximately 100 mm |
| Leadframe Size | Up to approximately 100 × 300 mm on applicable configurations |
| Epoxy Application | Dispensing or stamping, depending on configuration |
| Material Handling | Magazine, stack loader or reel-form handling, depending on configuration |
The published output is a machine reference value. Actual production speed depends on die size, epoxy pattern, leadframe indexing, vision alignment and the installed handling system.
Applications
The AD838 is mainly used to attach silicon dies or LED chips to leadframes, ceramic substrates and other compatible carriers with epoxy. Typical products include:
QFN and TQFP packages
PLCC and TSSOP packages
TSOP, SOIC and SOT packages
Diodes, transistors and other discrete devices
Power semiconductor packages
LED products on machines fitted with the correct substrate handler and tooling
Product compatibility is determined by the die dimensions, wafer frame, leadframe or substrate size, epoxy method, workholder, collet and ejector setup. A machine previously used for one package may require different tooling before it can run another.
Used Machine Configuration and Condition
Used AD838 machines are not all configured the same way. The available unit should be identified by its complete model, year, serial number and installed hardware. The suffix also matters: AD838, AD838L, AD838P and reel-handling versions should not be treated as identical machines.
The equipment list for a specific machine should state:
6-inch or 8-inch wafer table and wafer expander
Magazine, stack-loader or reel-form material input
Output magazine or other unloading arrangement
Writing dispenser, dot dispenser or stamping system
Bond head, rotary collet and ejector configuration
Installed cameras and pattern-recognition system
Workholders, magazines, collets and product tooling
Industrial PC, software version and available backup files
Manuals and spare parts included with the machine
Machine condition should be described as as-is, powered on, tested or refurbished. A recent power-on video can show basic movement, wafer handling, material transport, dispensing and bond-head operation. Placement accuracy and production readiness require a test with suitable tooling and representative material.
Availability and Price
AD838 availability changes because the model is supplied from the used-equipment market. The current machine year, configuration, location and condition are provided when a unit is available.
| Availability | Check current inventory |
|---|---|
| Condition | Used, tested or refurbished according to the machine offered |
| Price | Quoted according to configuration, condition and included tooling |
| Inspection | Machine photographs, video or on-site inspection when available |
| Export Packing | Available |
| International Delivery | Available subject to destination and export requirements |
For availability and pricing, provide the required wafer size, die dimensions, leadframe or substrate format, epoxy process, preferred equipment condition and destination country.
