The ASMPT AD280 Plus high-precision, fully automated die bonding system utilizes patented see-through image recognition technology to achieve a placement accuracy of ±3 µm (3σ) in the XY plane, while offering flip-chip handling capabilities and broad material compatibility. For optical module, LiDAR, and infrared LED packaging production lines that prioritize stable yields and process flexibility, the AD280 Plus provides a mature solution that balances high precision with traceability.
Core Technical Features
Precise placement capability. The core strength of the AD280 Plus lies in its patented see-through recognition system, which enables pattern alignment through the die itself, achieving ±3 µm @ 3σ XY positioning accuracy. This level of precision makes it well suited to position-sensitive optical coupling and die attachment applications.
Flexible material handling. The system comes standard with wafer expander or clamp ring feeding, with optional configurations including waffle pack, Gel-Pak, tray, and tape feeder. This material compatibility means production lines can switch between different package formats without frequent hardware platform changes.
Traceability and process control. The AD280 Plus supports barcode, 2D code, or OCR character reading at the substrate, wafer, and die levels, providing a data foundation for lot traceability and quality management. An optional bond force sensor enables precise control of bonding pressure, while rapid UV curing helps improve curing efficiency and placement stability.
Specification Summary
| Item | Parameter |
|---|---|
| XY placement accuracy | ±3 µm @ 3σ |
| Die rotation accuracy | ±0.1° @ 3σ |
| Maximum substrate handling | 8" × 8" (optional expansion) |
| Wafer size | Up to 8" (clamp ring/expander) |
| Machine dimensions | 2,150 × 1,400 × 2,300 mm |
The AD280 Plus suits production environments in optoelectronics packaging that require stable precision, flexible incoming material adaptation, and traceable data records. Specific configurations can be tailored to actual process requirements, and further evaluation is recommended based on incoming material formats and package types.
