Used ASMPT AD838L-Plus Automatic Die Bonder

The AD838L-Plus automatic die bonder delivers excellent repeatable placement accuracy for substrate and lead frame die attach amid ongoing die miniaturization. It supports multiple attach processes including epoxy, solder and sintering. Featuring solid process flexibility and lot stability, the platform suits IC, LED, MEMS, sensor and power device packaging production, with strengths beyond placement speed.

Core Technologies of the ASMPT AD838L-Plus Automatic Die Bonder

The AD838L-Plus is installed on ASMPT/ASM's automatic die-bonding platforms. Its core technology is primarily characterized by the following three aspects:

• Vision alignment and precise placement

  The vision system recognizes die and substrate marks to maintain placement repeatability. This matters most for small dies, multi-chip builds, and stacked die processes.

• Process compatibility
  Depending on configuration, the machine supports epoxy, solder, or sintering die attach. One platform covering multiple processes means less requalification when product mix changes.

• Automatic feeding and handling
  Built for batch production while still allowing multi-product changeover. For OSATs and packaging houses, this is the balance point between throughput and flexibility.

Product information