Used ASMPT AD832i Epoxy Die Bonder handles 8-inch substrates and delivers consistent high-speed epoxy die attach. Equipped with high-precision vision alignment for die placement, it works with various lead frames and substrates for discrete and optoelectronic device packaging. Fully refurbished and process-tested, it enables packaging manufacturers to expand epoxy die attach capacity with reduced capital expenditure.
Why the AD832i Fits 8-Inch Leadframe Packaging Workflows
Most die attach tools are built for either high-volume single-product runs or large die sizes. The AD832i fills a different niche: multi-device production on 8-inch wafers with small die and dense leadframe substrates.
Its epoxy dispense architecture is designed for tiny dot consistency, a critical pain point for QFN, SOP, SOIC and SOT packaging. The dual epoxy drop system stabilizes glue volume across long runs, reducing die tilt, voids and reject rates on micro components down to 6 mil die size. The bonding head maintains placement repeatability even during frequent recipe switches, which matters for contract packaging sites running multiple device lots in one shift.
The integrated inline process monitoring captures bonding statistics in real time. Operators can track dispense offsets, placement drift and force variation without pulling samples offline. This closed-loop visibility helps new process engineers stabilize epoxy bonding recipes faster, cutting validation time for new package types.
Specification Quick Reference
| Item | Specification |
|---|---|
| Package types | QFN, DFN, SOT, SOIC, SOP and other small-outline leadframes |
| Wafer handling | 8-inch (200mm), optional 5/6-inch |
| Die size range | 0.15×0.15 – 5.08×5.08mm (approx. 6–200mil) |
| XY placement accuracy | ±20μm @ 3σ (standard mode) |
| Rotation accuracy | ≥1mm: ±1°; <1mm: ±3° (@ 3σ) |
| Bond force | 10–300g programmable |
| Dispensing system | Dual dispense system, ultra-fine dispensing |
| Vision system | ASMPT in-house image recognition, 6×6–200×200mil |
| Substrate size | Length 160–300mm, width 50–102mm (standard) |
| Throughput | Approx. 20,000 UPH (40×40mil die; varies by product) |
| Die rotation function | Optional |
| Dimensions | 1,970 × 1,350 × 2,190mm (W×D×H) |
| Weight | Approx. 1,550kg |
| Power | Single-phase 220VAC, approx. 1,600W consumption |
| Compressed air | Minimum 6bar, 415LPM flow |
Refurbishment & Machine Condition
Our AD832i unit has gone through full mechanical, vision and dispense system inspection before listing. We focus on the wear items that directly affect die attach yield: bonding head motion, epoxy pump and nozzle assemblies, wafer handling stage, pattern recognition camera and substrate transport.
Each machine completes a dry run and epoxy bonding qualification test to verify placement accuracy, dispense stability and leadframe feeding performance. We document test results so your process team can review performance data before shipment.
As a pre-owned system, it does not carry the original manufacturer warranty. We offer optional on-site installation support, training and spare parts consultation to reduce commissioning risk for your packaging floor.
