Precise flip chip alignment directly underpins advanced interconnect performance. The ASM AFC Plus Flip Chip Bonder delivers reliable high-precision bonding with placement accuracy up to ±1.5µm.
Its advanced optical vision system ensures accurate die positioning for chip-to-wafer and 3D stacking applications. Flexible bonding force and temperature control accommodate diverse substrates and bump structures, supporting MEMS, micro-optics and high-density packaging requirements.
Stable motion control maintains consistent bonding results over long production runs. It minimizes alignment deviation and reduces assembly defects for high-value advanced packaging processes.
We have this flip chip bonder available for your production evaluation. Send your inquiry to get full machine data and quotation.
Technical Specifications (Typical Configuration)
| Parameter | Value |
|---|---|
| System Type | Automatic flip chip bonder |
| Placement Accuracy | ±2–5 μm @ 3σ (process dependent) |
| Bonding Methods | Mass reflow / Thermocompression bonding (TCB) |
| Wafer Size Support | 8-inch / 12-inch configurations |
| Substrate Types | Organic laminate, ceramic, silicon interposer |
| Throughput | Depends on alignment complexity and thermal cycle |
