Two mainstream flip chip bonding technologies serve different high-density packaging demands. Mass reflow and TCB (Thermal Compression Bonding) each carry distinct advantages for die attachment.
Mass reflow processes all interconnects simultaneously in a furnace. It delivers high throughput and lower operation cost, widely adopted for conventional flip chip products with larger bump pitches.TCB bonds bumps one by one with controlled heat and force. It achieves ultra-fine pitch interconnection, suitable for advanced packaging such as 2.5D / 3D stacking and high-performance chips.
Equipment selection hinges on bump structure, pitch size and production volume. Understanding these differences helps match your packaging line with the right placement solution.
Reach out to us for detailed equipment comparison and available machine options.
Technical Specifications (Industry Ranges)
| Parameter | Mass Reflow | TCB |
|---|---|---|
| Placement Accuracy | ±5 μm to ±15 μm @ 3σ | ±0.5 μm to ±2 μm @ 3σ |
| Supported Pitch | >100 μm | Sub-40 μm to 100 μm |
| Bonding Method | Flux + reflow oven | Localized heat + force |
| Throughput | High (5,000–15,000 UPH) | Medium to low (precision-driven) |
| Substrate Types | Organic laminates, leadframes | Silicon interposers, ceramics, organic substrates |
