The ASML XT 1250i is the world’s first TWINSCAN immersion DUV step-and-scan lithography system, adopting 193 nm ArF excimer laser for early immersion process development at the 65 nm node. It utilizes water immersion technology between lens and wafer to boost depth of focus, built upon ASML proven dual-wafer stage architecture for parallel metrology and exposure.
Equipped with Ultra-k1 process enhancement package, the system delivers tight Critical Dimension (CD) control and flexible illumination tuning. It separates metrology measurement in dry stage and exposure in wet immersion stage, effectively suppressing pattern distortion and improving imaging latitude for thin resist layers. This design greatly reduces thermal and mechanical overlay errors during continuous wafer batch processing.
Primarily deployed for early immersion technology qualification and R&D of logic and memory chips. It laid the technical foundation for subsequent mass-production immersion scanners and supports process exploration for advanced nodes before high-volume manufacturing.
