The ASMPT AD838L Automatic Die Bonder brings high-precision die attach performance for high-volume semiconductor packaging. It handles a wide range of chip sizes, placing dies accurately onto substrates or leadframes with controlled bonding force, suitable for power devices, sensors and general IC packages.
High-speed pick-and-place mechanics paired with visual alignment guarantee stable placement repeatability. Flexible recipe programming allows rapid product switching, supporting packaging sites managing multiple component types and tight production schedules.
ASMPT AD838L Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | AD838L |
| Equipment Type | Automatic die bonder |
| Application | Automated die pickup, alignment and placement in compatible packaging processes |
| Condition | Pre-owned semiconductor packaging equipment |
| Process Compatibility | Determined by the die, substrate, attach process, tooling and installed machine configuration |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
