The ASMPT IDEALmold 3G is designed for high-precision semiconductor compression molding, tailored to advanced thin and large-form-factor packages. It delivers uniform epoxy encapsulation while minimizing voids and package warpage, common pain points for modern packaging processes.
Its upgraded clamping and material dispensing hardware enables faster cycle times alongside stable process repeatability. The flexible mold platform accommodates diverse package types, supporting high-mix packaging workshops with streamlined mold replacement and recipe setup.
ASMPT IDEALmold 3G Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | IDEALmold 3G |
| Equipment Type | Automatic semiconductor transfer molding system |
| Primary Application | Semiconductor package encapsulation |
| Workpiece Compatibility | Determined by the substrate, package layout, installed mold and handling configuration |
| Molding Process | Transfer molding for compatible semiconductor packaging applications |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
