ASMPT IDEALmold 3G enables uniform epoxy encapsulation while minimizing voids and package warpage—common challenges in modern packaging processes.
Its upgraded clamping and dispensing hardware achieve faster cycle times while maintaining consistent process repeatability. The flexible mold platform accommodates a wide range of package types and simplifies mold changes and recipe setup, thereby supporting high-mix packaging operations.
ASMPT IDEALmold 3G Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | IDEALmold 3G |
| Equipment Type | Automatic semiconductor transfer molding system |
| Primary Application | Semiconductor package encapsulation |
| Workpiece Compatibility | Determined by the substrate, package layout, installed mold and handling configuration |
| Molding Process | Transfer molding for compatible semiconductor packaging applications |
| Condition | Pre-owned semiconductor packaging equipment |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
