The ASMPT ORCAS semiconductor packaging system offers highly flexible compression molding capabilities for modern semiconductor packaging. Uniquely supporting both liquid and granular epoxy materials on a single platform, it fully meets the requirements for wafer-level (WLP) and panel-level (PLP) fan-in and fan-out packaging.
Featuring independent multi-module clamping control and high-precision robotic handling, the system achieves exceptional coplanarity stability during the molding process. Its flexibly configurable process parameters and modular architecture enable rapid product changeovers, striking a perfect balance between high-precision prototyping and high-yield mass production for a wide range of advanced chip packaging applications.
ASMPT ORCAS Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | ORCAS |
| Equipment Type | Semiconductor molding system |
| Application | Semiconductor package encapsulation and related production handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed mold, package format and machine configuration |
| Molding Process | Confirmed according to the actual machine, mold and installed process components |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, mold and parts matching, and repair discussion |
| Shipping | Export packing and worldwide delivery |
