Tailored for cutting-edge advanced packaging scenarios, the ASMPT ORCAS Semiconductor Molding System delivers highly adaptable compression encapsulation for modern semiconductor packaging. It uniquely supports both liquid and granular epoxy materials in one unified platform, fully catering to wafer-level (WLP) and panel-level (PLP) fan-in and fan-out packaging requirements.
Featuring independent multi-module clamping control and high-precision robotic handling, the system achieves ultra-stable co-planarity accuracy during molding. Its flexible configurable process parameters and modular structure enable rapid product switching, perfectly balancing high-precision prototyping and high-yield mass production for diverse advanced chip packages.
ASMPT ORCAS Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | ORCAS |
| Equipment Type | Semiconductor molding system |
| Application | Semiconductor package encapsulation and related production handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed mold, package format and machine configuration |
| Molding Process | Confirmed according to the actual machine, mold and installed process components |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, mold and parts matching, and repair discussion |
| Shipping | Export packing and worldwide delivery |
