Consistent test accuracy across high-density fine-pitch wafers is effortlessly achieved with the ACCRETECH AP3000. This professional wafer prober breaks the limitations of ordinary probing equipment, perfectly fitting sophisticated 300mm and 200mm wafer test workflows.
Vibration suppression is at the core of its mechanical design. Adopting premium rigid structures and optimized motion calibration, the device maintains ultra-stable probe contact even during long-hour continuous mass production, eliminating test deviation caused by mechanical jitter.
Wide application flexibility is another standout feature. It performs excellently on high-precision testing for logic chips, power components and MEMS wafers. With adaptive recipe matching and low running failure rates, it delivers reliable on-site operation for advanced semiconductor manufacturing lines.
ACCRETECH AP3000 Machine Information
| Manufacturer | ACCRETECH / Tokyo Seimitsu |
|---|---|
| Model | AP3000 |
| Equipment Type | High-performance automatic wafer prober |
| Maximum Wafer Size | Up to 300 mm according to the manufacturer’s model information |
| Typical Device Applications | Memory, MPU/SoC, logic and power devices |
| Primary Functions | Wafer handling, alignment, positioning and probe-card contact for electrical testing |
| Condition | Pre-owned semiconductor test equipment |
| Test Configuration | Determined by the tester, test head, probe card, chuck and installed interfaces |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
