The ACCRETECH UF200R is a compact, fab-ready probing unit optimized exclusively for 200mm wafer production environments. It replaces bulky traditional probers with streamlined automation, perfectly matching the scale and throughput demands of mid-sized semiconductor fabs.
Built for daily batch probing tasks, the device integrates high-precision visual positioning and closed-loop motion control. It effectively corrects minor wafer offset during fast cycling, ensuring every probe contact remains precise and repeatable.
Designed for versatile process compatibility, it works stably with various wafer thicknesses and common chip categories. Simplified operation workflows cut frequent setup steps, letting production lines maintain continuous, efficient wafer probing operation with minimal manual intervention.
ACCRETECH UF200R Machine Information
| Manufacturer | ACCRETECH / Tokyo Seimitsu |
|---|---|
| Model | UF200R |
| Equipment Type | High-speed automatic wafer prober |
| Standard Wafer Range | 5- to 8-inch wafers according to the manufacturer’s model information |
| Optional Wafer Support | 4-inch wafer testing when the required configuration is installed |
| Typical Device Applications | Discrete, power, logic and compatible MEMS devices |
| Primary Functions | Wafer handling, alignment, positioning and probe-card contact for electrical testing |
| Condition | Pre-owned semiconductor test equipment |
| Test Configuration | Determined by the tester, test head, probe card, chuck and installed interfaces |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
