The ACCRETECH UF200R 200mm automatic wafer prober replaces bulky, traditional probing stations with a streamlined automated process, perfectly matching the scale and throughput requirements of mid-sized semiconductor wafer fabs. It integrates high-precision vision alignment and closed-loop motion control, effectively correcting for minute wafer shifts during rapid cycling to ensure precision and repeatability with every probe contact.
Designed for process versatility, the system reliably handles a wide range of wafer thicknesses and common chip types. Its simplified workflow minimizes setup requirements, enabling continuous, efficient wafer probing with minimal manual intervention.
ACCRETECH UF200R Machine Information
| Manufacturer | ACCRETECH / Tokyo Seimitsu |
|---|---|
| Model | UF200R |
| Equipment Type | High-speed automatic wafer prober |
| Standard Wafer Range | 5- to 8-inch wafers according to the manufacturer’s model information |
| Optional Wafer Support | 4-inch wafer testing when the required configuration is installed |
| Typical Device Applications | Discrete, power, logic and compatible MEMS devices |
| Primary Functions | Wafer handling, alignment, positioning and probe-card contact for electrical testing |
| Condition | Pre-owned semiconductor test equipment |
| Test Configuration | Determined by the tester, test head, probe card, chuck and installed interfaces |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
