The ACCRETECH FP2000 differentiates itself from conventional probe equipment by supporting frame-mounted wafer probing, catering uniquely to taped and diced wafer testing scenarios. It perfectly fits mid-process testing requirements for thin dies and fragile MEMS components that cannot be processed by standard wafer probers.
This unit adopts a specialized frame clamping and transmission mechanism to secure dicing frames stably during operation. It avoids displacement and chip damage during high-precision probing, effectively adapting to deformed or ultra-thin substrate materials.
Flexible mode switching allows free conversion between original wafer testing and frame material testing. With stable mechanical operation and accurate position calibration, the machine delivers consistent test performance for mixed-type production batches in semiconductor packaging and testing workshops.
ACCRETECH FP2000 Machine Information
| Manufacturer | ACCRETECH / Tokyo Seimitsu |
|---|---|
| Model | FP2000 |
| Equipment Type | Automatic frame-handling wafer prober |
| Primary Application | Electrical testing of diced wafers, packages and compatible devices attached to dicing frames |
| Frame Capability | 200 mm framed wafer handling according to the manufacturer’s model information |
| Wafer Capability | Compatible 5- to 8-inch wafers |
| Typical Products | CSP, WLCSP, diced wafer, package and compatible MEMS applications |
| Primary Functions | Frame or wafer loading, alignment, position correction and probe-card contact |
| Condition | Pre-owned semiconductor test equipment |
| Test Configuration | Determined by the tester, test head, probe card, chuck and installed interfaces |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
