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ASMPT SUNBIRD Turret Wafer-Level Test System

Pre-owned ASMPT SUNBIRD turret wafer-level test system for device handling, vision inspection and sorting. Ask about condition, configuration, parts and support.

ASMPT SUNBIRD Turret Wafer-Level Test System EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

Engineered exclusively for wafer-level testing (WLT) scenarios, the ASMPT SUNBIRD redefines efficiency for pre-packaging semiconductor validation processes. Unlike traditional package-based test handlers, this turret-style system performs direct electrical and functional testing on unsawn full wafers, eliminating intermediate handling steps and preserving wafer integrity.

Its high-speed rotary turret platform enables synchronous loading, probing, testing and unloading operations. This parallel processing architecture drastically cuts cycle time, delivering outstanding throughput for mass wafer-level inspection. Built-in high-precisionprobe alignment technology ensures stable contact accuracy across dense wafer die arrays, avoiding test misjudgment and improving overall test yield.

Fully adaptable to multiple wafer sizes and chip types including optoelectronic devices and logic discretes, the system supports flexible test recipe customization. Designed with industrial-grade stability and simplified operational workflows, it minimizes manual intervention and downtime. As a professional wafer-level test solution, it perfectly fits advanced semiconductor front-end test and process verification production lines.

ASMPT SUNBIRD wafer-level package inspection test and sorting system

ASMPT SUNBIRD Machine Information

ManufacturerASMPT
ModelSUNBIRD
Equipment TypeWafer-level package inspection, test and sorting system
Primary ApplicationsInspection and sorting of compatible wafer-level packages and singulated semiconductor devices
Inspection CapabilitySix-side inspection and micro-crack detection according to the installed vision configuration
Sorting MethodSorting according to inspection results and compatible upstream wafer-map data
Additional FunctionsIndividual-unit testing and laser marking when the required modules are installed
ConditionPre-owned semiconductor inspection and test equipment
Actual ConfigurationConfirmed according to the specific machine available
Delivery ScopeBased on the quotation and confirmed equipment list
SupportInitial fault review, component matching and repair discussion
ShippingExport packing and worldwide delivery