Tailored for precision semiconductor thermal processing, the AG Associates Heatpulse 8108 is a versatile single-wafer RTP system trusted for low-variation rapid thermal treatment. It supports core fabrication procedures including ion implantation annealing, silicide formation and thin-film oxidation, fitting perfectly for 150mm–200mm wafer mass production.
Boasting ultra-fast temperature ramp rates and multi-zone independent heating control, this unit delivers exceptional across-wafer thermal uniformity. Equipped with high-precision pyrometry temperature monitoring and closed-loop feedback adjustment, it eliminates thermal deviation, ensuring stable and repeatable process results for every single wafer.
Compact in footprint and highly adaptable, this field-proven thermal processor supports customizable recipe programming and high-throughput cassette-to-cassette operation. It delivers reliable performance with low operational failure rates, serving as a cost-effective upgrade to optimize thermal process stability and enhance overall fab yield.
AG Heatpulse 8108 Main Specifications
| Manufacturer | AG Associates |
|---|---|
| Product Family | Heatpulse |
| Model | 8108 |
| Equipment Type | Single-Wafer Rapid Thermal Processing System |
| Supported Wafer Sizes | Up to 200 mm; available listing identifies 150 mm and 200 mm wafers |
| Heating Method | Upper and lower tungsten lamp arrays |
| Temperature Measurement | Thermocouple or pyrometer, depending on installed configuration |
| Temperature Control | Closed-loop process temperature control |
| Cooling Method | Cold-wall heat-exchanger cooling in the published platform |
| Published Process Applications | Annealing, controlled diffusion, oxidation, activation and silicide formation |
| Process Atmosphere | Dependent on installed gas panel, chamber and options |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
