AG Associates Heatpulse 8108 is a versatile single-wafer rapid thermal processor recognised for low-variance rapid thermal processing performance. It handles core manufacturing workflows including ion implant annealing, silicide formation and thin-film oxidation for 150mm to 200mm wafer volume production.
Ultra-fast ramp rates and multi-zone independent heating control deliver outstanding across-wafer thermal uniformity. High-precision pyrometer temperature sensing paired with closed-loop feedback regulation minimises thermal deviation, securing repeatable, consistent process results wafer to wafer.
This field-proven thermal processor features a compact footprint and flexible operation. It accepts custom recipe programming and high-throughput cassette-to-cassette handling. Solid reliability and low failure rates make it a cost-effective upgrade to stabilise thermal processes and lift overall fab yield.
AG Heatpulse 8108 Main Specifications
| Manufacturer | AG Associates |
|---|---|
| Product Family | Heatpulse |
| Model | 8108 |
| Equipment Type | Single-Wafer Rapid Thermal Processing System |
| Supported Wafer Sizes | Up to 200 mm; available listing identifies 150 mm and 200 mm wafers |
| Heating Method | Upper and lower tungsten lamp arrays |
| Temperature Measurement | Thermocouple or pyrometer, depending on installed configuration |
| Temperature Control | Closed-loop process temperature control |
| Cooling Method | Cold-wall heat-exchanger cooling in the published platform |
| Published Process Applications | Annealing, controlled diffusion, oxidation, activation and silicide formation |
| Process Atmosphere | Dependent on installed gas panel, chamber and options |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
