The ASMPT MPHENIX trim-and-form system performs integrated trimming and lead-forming operations following the injection molding process. It singulates individual IC packages from lead frame strips and precisely bends the external leads into predetermined geometries—a critical back-end packaging step prior to final testing.
Featuring robust pressing capabilities and a dual-head processing architecture, the system maintains consistent forming precision even during continuous, high-volume production. It supports in-line optical inspection to detect lead deformation and dimensional deviations, enabling packaging facilities to meet the stringent reliability standards required for automotive-grade discrete devices and power modules.
ASMPT MPHENIX Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | MPHENIX |
| Equipment Type | Semiconductor trim and form system |
| Application | Leadframe-based package trimming, lead forming and related product handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed tooling, leadframe and package configuration |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, tooling comparison, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
