Built to handle high-density leadframe packages for automotive and power semiconductor production, the ASMPT MPHENIX Trim and Form System performs integrated trim and lead forming operations after molding. It separates individual packaged ICs from the leadframe strip and precisely bends external leads to defined geometries, a vital backend packaging step before final testing.
Boasting powerful press capacity and dual-head processing architecture, the machine delivers consistent forming precision even under continuous high-volume operation. It supports inline optical inspection to catch lead deformation and dimensional deviations, helping packaging plants meet strict reliability standards for automotive-grade discrete devices and power modules.
ASMPT MPHENIX Machine Information
| Manufacturer | ASMPT |
|---|---|
| Model | MPHENIX |
| Equipment Type | Semiconductor trim and form system |
| Application | Leadframe-based package trimming, lead forming and related product handling |
| Condition | Pre-owned semiconductor packaging equipment |
| Product Compatibility | Determined by the installed tooling, leadframe and package configuration |
| Actual Configuration | Confirmed according to the specific machine available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, tooling comparison, parts matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
