This fully automatic cleaning machine is engineered exclusively for semiconductor packaging processes. It delivers targeted cleaning to strip flux, ionic contaminants and tiny debris from bumps and substrate gaps, without inflicting any damage on delicate chip structures. Built with closed-loop liquid circulation and precise temperature control, it ensures consistent cleaning outcomes batch after batch. The compact footprint makes it simple to integrate into existing packaging lines, saving valuable fab floor space.
Boost your product long-term reliability and cut down reject rates caused by residual flux. Reach out to us now to get full process data and a competitive offer.
AC-420 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Semiconductor package cleaning machine |
| Main Application | Chip packaging post-process cleaning |
| Cleaning Method | Spray cleaning |
| Cleaning Target | Flux residue, particles, organic contamination |
| Process | Cleaning + DI rinse + drying |
| Application | IC package, semiconductor components, electronic assemblies |
| Operation | Automatic cleaning process |
