The AC-420 semiconductor cleaning machine precisely removes flux, ionic contaminants, and microscopic debris from the gaps between bumps and substrates without damaging delicate chip structures. It utilizes closed-loop fluid circulation and precise temperature control to ensure consistent cleaning results across batches. Its compact footprint allows for easy integration into existing packaging lines, saving valuable fab space.
Enhance long-term product reliability and reduce scrap rates caused by residual flux. Contact us today for comprehensive process data and a highly competitive quote.
AC-420 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Semiconductor package cleaning machine |
| Main Application | Chip packaging post-process cleaning |
| Cleaning Method | Spray cleaning |
| Cleaning Target | Flux residue, particles, organic contamination |
| Process | Cleaning + DI rinse + drying |
| Application | IC package, semiconductor components, electronic assemblies |
| Operation | Automatic cleaning process |
