SC810 is a fully automatic in-line cleaning machine for semiconductor packaging. It is mainly used to remove post-soldering flux and organic contaminants from IGBT, IPM, BGA, CSP and lead frames, widely adopted in power device and IC packaging processes.
It adopts dual-side high-pressure spray, integrating chemical cleaning, multi-stage DI water rinsing, air knife blow-off and IR hot-air drying. It comes with 0.2μm precision filtration and real-time DI water resistivity monitoring. The fluid path is made of corrosion-resistant SUS304 stainless steel. The PLC system stores multiple recipes with bilingual HMI, and the SMEMA interface allows integration into automatic production lines.
This used unit has completed full maintenance and pipeline flushing. Pumps, heaters and sensors have passed inspection and calibration for stable operation. It greatly cuts capital expenditure compared to new machines and is well suited for packaging line expansion and process pilot tests.
SC810 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic semiconductor package cleaning machine |
| Main Application | Post-solder semiconductor package cleaning |
| Cleaning Method | Spray cleaning |
| Cleaning Process | Chemical cleaning + DI water rinse + hot air drying |
| Target Contamination | Flux residue, organic and inorganic pollutants |
| Control System | PLC control system |
| Applications | Lead frame, IGBT, power module, semiconductor package |
