The SC810 fully automatic in-line semiconductor packaging cleaning machine utilizes a dual-sided high-pressure spray system, integrating chemical cleaning, multi-stage deionized (DI) water rinsing, air-knife blow-off, and infrared hot-air drying. It features 0.2μm precision filtration and real-time monitoring of DI water resistivity. Fluid pathways are constructed from corrosion-resistant SUS304 stainless steel. The PLC system supports multiple stored recipes and a bilingual HMI, while the SMEMA interface allows for integration into automated production lines.
This pre-owned unit has undergone comprehensive maintenance and pipeline flushing. Pumps, heaters, and sensors have been inspected and calibrated to ensure stable operation. Compared to new equipment, it offers significant capital expenditure savings, making it an ideal choice for packaging line expansions and process pilot runs.
SC810 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic semiconductor package cleaning machine |
| Main Application | Post-solder semiconductor package cleaning |
| Cleaning Method | Spray cleaning |
| Cleaning Process | Chemical cleaning + DI water rinse + hot air drying |
| Target Contamination | Flux residue, organic and inorganic pollutants |
| Control System | PLC control system |
| Applications | Lead frame, IGBT, power module, semiconductor package |
