Packaging yields plagued by flux residue and micro debris? Our FC750 automatic chip cleaning system is purpose-built for post-dicing and post-bond cleaning in semiconductor packaging.
This automatic cleaning machine balances cleaning power and chip protection. It efficiently strips soldering flux, organic residues and fine particles without causing scratches or damage to delicate chips. Built-in closed-loop fluid control keeps every batch’s cleaning output consistent.
Engineered for continuous mass production, it cuts manual handling and lowers defect rates caused by contamination. If you’re looking to optimize your packaging process and reduce scrap loss, the FC750 delivers reliable performance with easy integration into existing production lines.
Get in touch with us today for detailed specs and a competitive quotation.
FC750 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic semiconductor packaging cleaning machine |
| Application | Chip packaging and semiconductor assembly cleaning |
| Cleaning Method | Online water cleaning |
| Main Function | Flux residue and contamination removal |
| Process | Cleaning + rinsing + drying |
| Control System | Automatic control system |
| Water System | High purity water cleaning technology |
| Production Type | High-volume semiconductor packaging |
