Struggling with packaging yields affected by flux residue and microscopic debris? Our FC750 automatic chip cleaning machine strikes the perfect balance between cleaning efficiency and chip protection. It effectively removes flux, organic residues, and tiny particles without scratching or damaging delicate chips. An integrated closed-loop fluid control system ensures consistent cleaning results across every batch.
Designed for continuous, high-volume production, this equipment minimizes manual intervention and reduces defect rates caused by contaminants. If you are looking to optimize your packaging process and reduce scrap loss, the FC750 is the ideal choice—offering reliable performance and seamless integration into existing production lines.
Contact us today for detailed specifications and a competitive quote.
FC750 Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Automatic semiconductor packaging cleaning machine |
| Application | Chip packaging and semiconductor assembly cleaning |
| Cleaning Method | Online water cleaning |
| Main Function | Flux residue and contamination removal |
| Process | Cleaning + rinsing + drying |
| Control System | Automatic control system |
| Water System | High purity water cleaning technology |
| Production Type | High-volume semiconductor packaging |
