When advanced process nodes demand uncompromising wafer cleanliness, the TEL CELLESTA™-i MD stands out as a reliable single-wafer cleaning solution for 300mm wafers.
This wet cleaning platform adopts a modular design to handle diverse pre-etch and post-deposition cleaning tasks. Its precisely controlled chemical delivery gently removes particles and metallic contaminants while preserving delicate fine patterns on wafers. Built for high-volume advanced semiconductor fabs, it delivers stable throughput with low defect generation. The flexible recipe configuration easily adapts to different process requirements, simplifying line integration and process migration.
If you are sourcing proven 300mm wet processing equipment for capacity expansion or process upgrade, get in touch with us for more details and a competitive quotation.
TEL CELLESTA™-i MD Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Single wafer cleaning system |
| Manufacturer | Tokyo Electron (TEL) |
| Model | CELLESTA™-i MD |
| Wafer Size | 300mm |
| Process Type | Wet wafer cleaning |
| Main Function | Particle removal and surface cleaning |
| Application | Advanced semiconductor manufacturing |
| Target Market | Logic, memory and advanced semiconductor fabs |
