As advanced process nodes demand exceptional levels of wafer cleanliness, the TEL CELLESTA™-i MD stands out as a reliable single-wafer cleaning solution for 300mm wafers, thanks to its superior performance.
The TEL CELLESTA-i MD 300mm single-wafer cleaning system is capable of handling a wide range of pre-etch and post-deposition cleaning tasks. Utilizing precision-controlled chemical delivery technology, the system effectively removes particles and metallic contaminants while preserving delicate wafer patterns. Designed for high-volume advanced semiconductor fabs, the platform ensures stable productivity and ultra-low defect rates. Its flexible process recipe configuration easily adapts to diverse requirements, streamlining production line integration and process migration.
If you are seeking proven, reliable 300mm wet processing equipment to expand capacity or upgrade your processes, please contact us for further details and a competitive quote.
TEL CELLESTA™-i MD Technical Specifications
| Parameter | Description |
|---|---|
| Equipment Type | Single wafer cleaning system |
| Manufacturer | Tokyo Electron (TEL) |
| Model | CELLESTA™-i MD |
| Wafer Size | 300mm |
| Process Type | Wet wafer cleaning |
| Main Function | Particle removal and surface cleaning |
| Application | Advanced semiconductor manufacturing |
| Target Market | Logic, memory and advanced semiconductor fabs |
