Continuous strip handling shapes how the ASM Eagle Aero roll-to-roll wire bonder executes fine-pitch wire bonding. It melts 0.5mil fine wire into 22 µm bond balls and holds placement error within 2.0 μm @3σ. Gold-plated, copper-plated and palladium-coated copper wire run through this workflow. AeroEye sits inside each bonding cycle. While strips move fast, it reads interface conditions and picks up bad joints or drifting settings. Timing of motion steps gets optimised, pushing UPH up by as much as 30% over conventional wire bonders.
Strip transport runs separately from magazine exchange, so bonding keeps going without stops. Wire loop geometry, including height and bend profiles, changes via recipe edits. No mechanical rework is needed. The SECS/GEM link connects the machine to higher-level factory controls. Every bond event logs against part IDs, creating a full audit trail for production batches.
Core Technology Specifications for the ASM Eagle Aero Roll-to-Roll Wire Bonder
| Item | Description |
|---|---|
| Model | ASM Eagle Aero Roll-to-Roll Wire Bonder |
| Workflow Logic | In-line wire bonding on moving strips, continuous processing |
| Wire Compatibility | Au-plated, Cu-plated, Pd-coated copper wire |
| Performance | 22 µm bond ball from 0.5mil wire; 2.0 μm @3σ placement |
| In-process Check | AeroEye embedded into bonding cycle for real-time interface reading |
| Throughput | Up to 30% UPH gain over standard wire bonders |
| Automation | Magazine swap independent of bonding, recipe-driven loop setup, SECS/GEM audit trail |
