The ASM Eagle Aero is a high-performance Reel-to-Reel Wire Bonder built for continuous semiconductor assembly on rolled leadframes. Powered by patented X-Power thermosonic bonding, it delivers fine-pitch interconnects and supports gold, copper and palladium-coated copper wires.
It achieves 22μm bond balls with 0.5mil fine wire and maintains bonding accuracy at 2.0 μm @3σ. The integrated AeroEye real-time monitoring system tracks bonding quality continuously, detecting defects and unstable parameters during high-speed reel feeding. Its high-speed motion platform boosts UPH by up to 30% compared with conventional wire bonders.
The continuous reel transport eliminates magazine loading interruptions, enabling non-stop inline assembly. Programmable loop profiles support flexible wire looping geometry, and it features SECS/GEM interface for smart fab integration and full production lot traceability.
Technical Specifications (Typical Configuration)
| Parameter | Specification |
|---|---|
| System Type | Continuous reel-to-reel thermosonic wire bonder |
| Substrate Format | Embossed tape, FPC, reel-fed carriers |
| Supported Wire Materials | Gold (Au), Copper (Cu), Palladium-Coated Copper (PCC) |
| Bonding Accuracy | ±2.5 μm to ±4.0 μm @ 3σ (process and tension dependent) |
| Wire Diameter Range | 15 μm – 50 μm (0.6–2.0 mil) |
| Production Mode | Continuous high-UPH operation (no indexing downtime) |
