Precision bonding directly shapes the reliability of packaged chips. The ASM Eagle AERO Wire Bonder leverages patented X-Power thermosonic bonding and dual-frequency transducer technology to deliver ultra-stable interconnection.
It supports gold, copper, palladium-coated copper and silver wire, capable of forming 22μm bond balls with 0.5mil wire. The integrated AeroEye software runs real-time process tracking, locking consistent bonding parameters throughout continuous production cycles.
Output capacity can increase by up to 30% in copper wire processes. High-speed motion control maintains outstanding positioning repeatability, cutting bonding defects and lowering scrap loss.
We have this wire bonder ready for your production assessment. Send your inquiry to get full performance data and quotation.
ASM Eagle AERO Technical Overview
| Parameter | Description |
|---|---|
| Equipment Type | Automatic ball wire bonding system |
| Main Application | High-end IC semiconductor packaging |
| Bonding Technology | Thermosonic wire bonding |
| Wire Material | Copper wire, gold wire and compatible materials |
| Application Area | Advanced IC, QFN, DFN and semiconductor packages |
| Production Mode | High-volume automated manufacturing |
Actual bonding capability depends on package structure, wire diameter, process parameters, and production requirements.
