ASMPT Eagle AERO is a thermosonic wire bonder for high-end IC packaging, performing ball bonding and stud bumping.
Key Features:
Patented X-Power thermosonic bonding technology with dual-frequency Aeroducer transducer (X and Y directions)
Up to 30% higher UPH compared to conventional bonders (typical Cu wire application)
Bond ball size as small as 22μm with 0.5mil wire; application-ready down to 30μm
Bonding speed up to 24 wires/second (2mm length)
Bond placement accuracy of 2.0μm @ 3σ
Supports gold wire standard; optional copper, silver, and alloy wire configurations
AeroEye real-time monitoring software for process control and quality assurance
iHawk AERO configuration available for low-pin-count discrete devices
Key Specifications:
| Item | Specification |
|---|---|
| Bonding Method | Thermosonic with X-Power |
| Wire Size | 0.5 - 2.0 mil (12.7 - 50.8 μm) |
| Wire Length | 0.2 - 8.0 mm |
| Bonding Accuracy | 2.0 μm @ 3 sigma |
| Bond Ball Size | Down to 22 μm (with 0.5mil wire) |
| Bonding Area | 56mm × 90mm (leadframe width ≤ 100mm) |
