ASMPT Eagle AERO Wire Bonder | High-End IC Packaging Solution

The Eagle AERO is a high-performance wire bonding platform from ASMPT, designed for fine-pitch high-density packaging applications. It supports SiP, BGA, QFP, memory and power device packaging. Compatible with gold, low-oxygen copper and alloy wires, it is widely deployed for consumer electronics and automotive chip interconnection.

It features ASMPT proprietary X‑Power thermosonic bonding solution and Aeroducer dual-frequency transducer with dual-axis ultrasonic output, delivering up to 30% throughput gain for copper wire processes versus previous generations. The carbon-fiber maglev XY stage offers bonding accuracy of ±2.0μm@3σ. It forms reliable 22μm balls with 0.5mil wire and handles pad pitch down to 30μm. The AeroEye in-line process monitor captures bonding waveforms continuously and raises alarms to maintain consistent production quality.

This pre-owned unit has undergone full preventive maintenance and stage calibration. Optical and ultrasonic modules have been re-tested, with all core specifications met and reliable machine condition. It significantly reduces project CAPEX compared to new equipment and fits line expansion, copper wire process development and pilot production.