Consistent bonding accuracy directly drives stable mass production output. The KAIJO FB-e20N fully automatic ball bonder delivers repeat precision of ≤2.0μm @3σ, with a fast cycle time of just 43ms per wire.
Powered by the upgraded α eyes recognition algorithm, it suppresses interference and maintains reliable pattern recognition across long production runs. Dual-frequency ultrasonic transducer supports flexible bonding parameter tuning, compatible with gold, copper and silver alloy wires for discrete chips, LED and small IC packages. The Step Bond Sequence function visualizes bonding workflows for fine process adjustment.
Standard SECS/GEM interface enables seamless fab connection for full data traceability. Automatic wire threading and capillary cleaning cut routine maintenance downtime and maximize equipment uptime.
Technical Specifications (Typical Configuration)
| Parameter | Specification |
|---|---|
| System Type | Fully automatic thermosonic wire bonder |
| Supported Wire Materials | Gold (Au), Copper (Cu), Palladium-Coated Copper (PCC) |
| Bonding Accuracy | ±2.0 μm to ±3.5 μm @ 3σ (process dependent) |
| Wire Diameter Range | 15 μm – 50 μm |
| Substrate Types | Leadframes, organic laminates, strip carriers |
| Production Focus | High-volume manufacturing (high UPH / stable yield) |
