Wide bonding workspace unlocks flexible packaging production. The KAIJO FB-x26 fully automatic wire bonder features an expanded bonding area up to 56mm × 95mm, supporting large form factor packages and wafer-level bumping tasks.
Powered by the proprietary α-eyes recognition algorithm, it delivers stable pattern identification and minimizes alignment errors. Its lightweight, high-rigidity bonding head applies low impact load during bonding, protecting delicate dies while supporting gold, copper and silver wire processes. Built-in auto capillary cleaning and automatic wire threading reduce routine downtime.
The system comes with SECS/GEM interface for fab automation integration. It maintains consistent bonding performance through long production runs, ideal for high-volume IC and discrete device assembly.
Technical Specifications (Typical Configuration)
| Parameter | Specification |
|---|---|
| System Type | Fully automatic thermosonic wire bonder |
| Supported Wire Materials | Gold (Au), Copper (Cu), Palladium-Coated Copper (PCC) |
| Bonding Accuracy | ±2.0 μm to ±3.0 μm @ 3σ (process dependent) |
| Wire Diameter Range | 15 μm – 50 μm (0.6–2.0 mil) |
| Substrate Compatibility | Leadframes, organic laminates, strip carriers |
| Throughput | High-UPH optimized continuous production mode |
