The KAIJO FB-x26 wire bonder offers a bonding range up to 95 mm. Its lightweight arm, vision compensation and segmented process control maintain accuracy and reduce impact for large-area bonding. The bonding head uses a composite arm with compact 1701 transducer. This lightweight design lowers momentum when the Z-axis moves fast to touch pads. Together with high-speed contact detection, it keeps bond force low to prevent micro-cracks on low-k films and thin dies. The arm stays rigid, so ultrasonic energy loses little power over long travel for long-loop wire bonding.
It runs the Alpha Eye recognition algorithm. Large-area bonding often suffers from pad oxidation, uneven lead plating and substrate colour variation, leading to low contrast or contaminated surfaces. The algorithm uses shape recognition and multi-correlation calculation to improve detection. During production, it automatically corrects recognition drift when images shift slightly, cutting downtime and recipe tuning work caused by alignment issues.
The Step Bond Sequence function on the KAIJO FB-x26 wire bonder breaks bonding away from simple single-trigger settings into segmented, controllable process steps. Operators can view and adjust the profiles for ultrasonic power, bond force and time in separate segments. For gold, copper or silver alloy wire applications, process engineers tune energy delivery at ball bond or wedge bond stages based on pad materials. This balances wide wire compatibility and steady bond quality.
The FB-x26 includes SECS/GEM interface as standard and works with KAIJO’s native KISS host management system. Built-in auto wire threading and automatic capillary cleaning keep production running through long batches. An optional barcode reader adds extra support. These features cut manual handling and link bonding parameters to part traceability data, satisfying basic lot control needs for high-volume IC assembly.
KAIJO FB-x26 Core Technical Specifications at a Glance
| Technical Dimension | FB-x26 Implementation | Significance for Production |
|---|---|---|
| Bonding range | 95 mm class wide-area bonding | Accommodates large package frames |
| Arm structure | Composite wire bonding arm + 1701 transducer | Low-impact contact, protects thin dies and low-k materials |
| Vision recognition | α eyes algorithm (shape recognition + multi-value correlation processing) | Stable alignment on low-contrast, contaminated surfaces |
| Process control | Step Bond Sequence, segment-adjustable | Au/Cu/Ag multi-wire compatibility, controllable bond consistency |
| Line integration | SECS/GEM + KISS management system | Parameters bound to traceability data, supports batch management |
| Automation | Auto wire threading, auto capillary cleaning, optional barcode reading | Reduces manual intervention, sustains continuous-run uptime |
KAIJO FB-x26 Bonder Application Scenarios
The KAIJO FB-x26's technical emphasis centers on 95 mm class wide-area bonding scenarios. It suits high-volume IC assembly lines with larger frame sizes, multiple wire types, and clear requirements for low-impact bonding. Where a line's core demands are maintaining bond accuracy and joint consistency across large frames while requiring line data integration capability, the FB-x26's technical approach aligns well with those needs
