Fine-pitch packaging demands ultra-stable bonding repeatability. The KAIJO FB-i28 fully automatic thermosonic ball bonder delivers ±2µm bonding repeat accuracy with a cycle speed of 0.045 seconds per wire.
Its lightweight high-rigidity bonding head cuts impact force during contact, protecting delicate die pads for low-loop and long-wire structures. The upgraded α-eyes visual recognition system maintains reliable alignment, supporting gold, copper and silver alloy wire processes across leadframe and COB packages. Built-in automatic wire threading and capillary cleaning reduce routine downtime. SECS/GEM interface enables seamless fab automation integration for traceability and remote process monitoring.
Consistent bonding performance minimizes interconnection defects during continuous mass production. We have this wire bonder ready for your production evaluation. Send your inquiry to get full machine data and quotation.
Technical Specifications (Engineering Range)
| Parameter | Specification |
|---|---|
| System Type | Fully automatic high-precision wire bonder |
| Wire Materials | Au / Cu / PCC |
| Bonding Accuracy | ±1.5 μm to ±2.5 μm @ 3σ |
| Minimum Pad Pitch | Sub-40 μm class capability |
| Wire Diameter Range | 15 μm – 50 μm |
| Substrate Types | Leadframe / organic laminate / strip carriers |
| Throughput | Optimized for high-yield advanced packaging production |
