The ASMPT AD830 Plus high-speed epoxy die bonder delivers fast die attach with high repeatable accuracy for production lines packaging LEDs, optocouplers, sensors and discrete components.
This used unit retains the proven robust performance of the AD830 Plus platform at a fraction of the new machine cost. It is a practical option for packaging factories expanding epoxy die attach capacity without large capital expenditure.
Key Specifications
| Item | Specification |
|---|---|
| Equipment type | High-speed epoxy die bonder |
| Bonding method | Epoxy dispensing / stamping |
| Cycle time | 0.16 sec/chip |
| Die size range | 0.15mm × 0.15mm to 5.08mm × 5.08mm |
| Leadframe length | 110mm – 300mm |
| Leadframe width | 12mm – 102mm |
| Bond head | Linear motor bond head with rotary bond arm |
| Angle correction | Automatic during pick-and-place |
| Dispensing | Dual dispensing / dual stamping capable |
| Inspection | Pre-bond and post-bond inspection |
| Condition | Used, inspected and functional |
| Applications | LED, optocoupler, optical sensor, discrete device packaging |
Why the AD830 Plus still stands out
0.16 sec/chip cycle time. The AD830 Plus achieves its speed through a linear motor bond head and rotary bond arm that corrects die angle during pick-and-place, reducing unnecessary motion rather than simply pushing the mechanism harder.
Wide die range. Supports die sizes from 0.15mm × 0.15mm up to 5.08mm × 5.08mm, covering the small-to-medium die commonly used in optoelectronics and sensor assembly.
Flexible frame handling. Accepts leadframes from 110mm to 300mm in length and 12mm to 102mm in width, so one machine can run multiple product types.
Dual dispensing / dual stamping. Handles different epoxy viscosities and bond line requirements without changing hardware.
Pre- and post-bond inspection. Built-in inspection confirms pick status before bonding and judges placement quality immediately after, helping intercept missing die, angle offset, and epoxy inconsistencies before they reach downstream processes.
About this used unit
We inspect every used AD830 Plus for bond head motion, vision system stability, and dispensing repeatability, and it comes with standard tooling and configuration—contact us with your die size, leadframe drawing, and target output for a match assessment; we also provide 12+ months warranty on this machine, and while the used die bonder market typically offers only 30 to 90 days of warranty, our 12+ month coverage means you can still rely on our technical support and repair service well after purchase, instead of bearing unexpected repair costs on your own.
