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Used ASMPT AD211Plus-II Eutectic Die Bonder

Before buying a used AD211Plus-II, know its specs, its void-rate limits, the parts that wear out, and the jobs it was built for.

Used ASMPT AD211Plus-II Eutectic Die Bonder EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

ASMPT AD211Plus-II is a fully automatic eutectic die bonding system built around a heated-nozzle bonding head. It's designed for high-speed eutectic attachment of singulated dies to substrates or lead frames, and has a strong installation base in LED manufacturing — particularly automotive lighting and outdoor lighting applications.

Equipment information for the used ASMPT AD211Plus-II Eutectic Die Bonder

Key Specifications

ItemSpecification
XY placement accuracy±7 µm @ 3σ
Die rotation accuracy±1° @ 3σ (dies larger than 0.5 mm)
Void rate controlBelow 3%
Cycle timeApprox. 540 ms
Production UPHApprox. 7k
Die size range0.15 × 0.15 mm to 2 × 2 mm
Substrate sizeUp to 102 × 127 mm
Bonding methodEutectic bonding, heated-nozzle bonding head
Atmosphere controlH2 mixed forming gas
WarrantyOne year or longer

Placement Accuracy

The AD211Plus-II delivers ±7 µm @ 3σ XY placement accuracy, with die rotation accuracy of ±1° @ 3σ for dies larger than 0.5 mm. That accuracy level matters for applications where the gap between bottom electrodes needs to be tight — better heat dissipation and more consistent optical alignment follow from cleaner placement.

ASMPT AD211Plus-II Heated Collet Eutectic Die Bonder

Eutectic Process Control

The machine's core strength lies in how it manages the eutectic bonding environment. ASMPT's patented heated-nozzle technology is central here, paired with strict forming gas control (H2 mixture) to maintain a clean, oxygen-controlled atmosphere during bonding. The result is void rate control below 3% — a critical metric for thermal management in high-power LED and photonics devices.

A smart heating system shortens the die's exposure to high temperature, reducing thermal stress on the component. An optional feature provides accurate heated-nozzle temperature detection.

Speed and Materials

Cycle time is rated at approximately 540 ms, supporting throughput figures cited around 7k UPH in production settings. The system accepts dies from 0.15 × 0.15 mm up to 2 × 2 mm and substrates up to 102 × 127 mm.

Key Points to Check When Buying Used Equipment

Because this model's eutectic performance depends on the heated nozzle and gas delivery system, those are the components worth verifying first. Request records on nozzle temperature calibration and forming gas flow consistency. The work holder and heat-up stage also see thermal cycling over the machine's life — check for warping or uneven heating.

Just as important as the hardware itself is after-sales warranty coverage. Used eutectic bonders can develop issues that only surface once the machine is running under your specific process conditions — a nozzle drift, a gas flow inconsistency, a heating stage that behaves differently under production load. Every used ASMPT AD211Plus-II we sell comes with a warranty of one year or longer — well beyond the typical 30- to 90-day coverage most used equipment dealers offer. That longer window reflects our confidence in the machines we prepare and means the risk of an early-life failure doesn't land entirely on your side.