The ASMPT AD8312Plus is a 12-inch automatic epoxy die bonder developed for high-density leadframe production. Published platform information includes material handling up to 300 × 100 mm, uplook optics and a group of process-control functions for dispensing, bonding, inspection and warped-material handling.
For a used AD8312Plus, these features should not be treated as names on a brochure. The machine’s value depends on which functions remain installed, enabled, calibrated and usable with the intended die, epoxy and leadframe.
A lower-priced machine missing its sensing, vision or product-handling components may cost more to return to production than a more complete unit with the correct workholder, software and process history.
Where a Used AD8312Plus Earns Its Value
The AD8312Plus is most relevant when the production requirement goes beyond basic wafer-to-leadframe placement. Its additional value comes from controlling process variation across larger and denser production material.
| Production Requirement | Relevant AD8312Plus Function | Evidence Required on a Used Machine |
|---|---|---|
| Consistent epoxy deposits | iDispense | Representative dispensing test showing dot shape, volume, position and tailing control |
| Changing surface height | iSense | Sensor calibration and level measurement across the intended work area |
| Thin dies or special epoxy | iTouch | Controlled pickup and bonding motion using representative die thickness and material |
| Fast visual recognition | iFlash | Camera, lighting, software and inspection test using actual product features |
| Warped leadframes | iFlat | Material handling and bonding test using leadframes with representative warpage |
| Improved alignment checking | Uplook optics | Optics, lighting, calibration and enabled recognition functions |
| Stable high-speed operation | iBalance | Mechanical condition and placement results during a sustained production run |
If the intended product does not require these functions, purchasing the AD8312Plus only because it is a 12-inch machine may not provide a practical advantage.
Published AD8312Plus Platform Information
| Manufacturer | ASM / ASMPT |
|---|---|
| Model | AD8312Plus |
| Equipment Type | Fully automatic epoxy die bonding system |
| Wafer Handling | 12-inch wafer platform |
| Leadframe Handling | High-density material up to 300 × 100 mm |
| Workholder | Universal workholder platform requiring product-specific setup |
| Dispensing Control | iDispense for epoxy-tailing control |
| Level Measurement | iSense |
| Bonding Motion Control | iTouch for thin dies and special epoxy processes |
| Vision and Inspection | iFlash and uplook optics |
| Warpage Handling | iFlat |
| Vibration Control | iBalance |
ASMPT’s current public page does not provide one universal throughput, placement accuracy, die-size range or bond-force specification for every AD8312Plus application. These values should be taken from the exact machine documentation or demonstrated with representative material.
Why 300 × 100 mm Handling Does Not Confirm Product Fit
The published 300 × 100 mm figure describes the maximum material envelope of the platform. It does not mean every leadframe within that size can run on every used AD8312Plus.
The actual machine must still match:
Leadframe length, width and thickness
Matrix layout and indexing pitch
Magazine dimensions and loading direction
Clamping and workholder contact points
Leadframe surface condition and allowable handling area
Strip warpage and required support
Dispensing and bonding positions
Output magazine or downstream interface
A “universal workholder” is a configurable platform, not universal product tooling. Missing clamps, nests, inserts and change parts can become a significant conversion cost.
Which iFeatures Are Actually Included?
A used-machine quotation should not simply copy all iFeatures from the original product brochure. It should identify the condition of each function on the physical machine.
| Function | Installed | Enabled | Tested |
|---|---|---|---|
| iDispense | Confirm hardware | Confirm software and license | Test with representative epoxy |
| iSense | Confirm sensor | Confirm measurement function | Check calibration and repeatability |
| iTouch | Confirm bond-head configuration | Confirm control function | Test with representative die |
| iFlash | Confirm cameras and lighting | Confirm inspection algorithms | Test recognition and inspection |
| iFlat | Confirm required components | Confirm software function | Test warped material handling |
| Uplook Optics | Confirm camera and optical path | Confirm pattern recognition | Check alignment and calibration |
“Installed” does not mean “operational,” and “operational” does not mean “qualified for the intended product.” These three states should be separated in the inspection report.
Dispensing and Bond-Line Control
The AD8312Plus should be evaluated as an epoxy-process platform rather than only a high-speed placement machine. Dispense quality affects epoxy coverage, fillet shape, bond-line thickness and contamination around the die.
A useful dispensing test should check:
Epoxy type, viscosity and working life
Dispensing pump, valve, needle and controller condition
Dot or pattern position on the leadframe
Volume consistency across the complete strip
Epoxy tailing, dripping, splash and missing deposits
Height compensation across warped material
Die placement into the dispensed epoxy
Final bond-line and fillet acceptance
A demonstration using water or an unrelated low-viscosity material cannot establish performance with the intended production epoxy.
Thin-Die and Warped-Leadframe Claims Need Product Testing
iTouch and iFlat are relevant when the process involves thin dies, special epoxy or leadframe warpage. Their presence does not guarantee that the available machine can run any thin die or warped strip.
Representative testing should combine:
The intended die dimensions and thickness
The actual or comparable wafer tape
Matching collet and ejector tooling
The required leadframe and workholder
The intended epoxy or a technically comparable material
Production-speed pickup, dispensing and placement
Check for die cracking, pickup damage, die tilt, epoxy overflow, unstable bond-line thickness and placement variation. A slow manual demonstration may not reveal problems that appear during sustained production.
AD832i, AD8312Plus or SD8312?
| Model | Primary Process | Wafer Platform | Best Starting Point |
|---|---|---|---|
| ASMPT AD832i | Epoxy die attach | 8-inch | Small packages, ultra-small dots and dies down to the published 6 mil capability |
| ASMPT AD8312Plus | Epoxy die attach | 12-inch | High-density leadframes up to 300 × 100 mm, thin-die control and warped-material handling |
| ASMPT SD8312 | Soft solder die attach | 12-inch | Leadframe-based power devices requiring controlled thermal and process-atmosphere conditions |
Choose between the AD832i and AD8312Plus according to wafer size, leadframe dimensions and the process-control functions the product actually needs. Choose between the AD8312Plus and SD8312 according to the die attach material—not because both machines accept 12-inch wafers.
If flip chip processing is required, the machine should not be assumed to support it because it belongs to the AD8312 series. The AD8312FC is the separate configuration identified by ASMPT for flip chip and direct die attach.
Evidence to Request for a Used AD8312Plus
| Machine Identity | Nameplate, serial number, year and complete model designation |
|---|---|
| Previous Application | Wafer, die, leadframe and epoxy information when available |
| Installed Modules | Itemized list of dispensing, sensing, vision and material-handling components |
| Tooling | Workholders, clamps, magazines, collets, ejectors and dispensing tools |
| Software | Version, licenses, enabled iFeatures, recipes and available backups |
| Functional Test | Wafer loading, leadframe indexing, dispensing, pickup, vision and placement |
| Process Test | Representative material with recorded dispensing, placement and output results |
| Known Condition | Current alarms, replaced parts, missing modules and incomplete repairs |
A power-on video is useful evidence of basic operation, but it cannot prove epoxy control, warped-strip handling or production repeatability.
Used ASMPT AD8312Plus Availability
Availability and price depend on the year, material-handling configuration, installed iFeatures, optics, software, included tooling and completed test scope of the actual machine.
Other used ASM and ASMPT die bonders may be considered when an available AD8312Plus does not match the required wafer, leadframe or die attach process.
Availability: Confirm against the physical machine
Configuration: Supplied with an itemized module and tooling list
Condition: Defined by the completed inspection and test scope
Price: Based on the actual machine, enabled functions and included components
Export: International packing and shipment can be arranged
Send the wafer format, die dimensions, leadframe drawing, epoxy information, bond-line requirement, expected output and destination through our equipment inquiry form.
