Equipment Type: 12-inch fully automatic epoxy die bonder
Brand & Model: ASMPT AD8312Plus
Process Positioning: Epoxy dispensing + die attach, for leadframe-based packaging
Applicable Packaging: SOP / SOT / QFP / QFN and other mainstream package types
Equipment Condition: Used, units typically manufactured around 2020, exact year subject to actual machine
The ASMPT AD8312Plus automatic epoxy die attach platform processes high-density lead frames. Its workflow dispenses silver epoxy onto 12-inch lead frames, accurately places dies at target positions, and forms electrical connections and mechanical fixation after epoxy curing.
The machine sustains stable yield during long continuous production runs. It supports mature package types including SOP, SOT, QFP and QFN. Its functional setup matches practical production requirements for these packages, eliminating unnecessary features to control capital expenditure.
Core Capability Parameters
| Item | Specification Range |
|---|---|
| Worktable Size | 300 × 100mm (12-inch leadframe) |
| Placement Accuracy | ±25μm range (subject to actual machine measurement) |
| Die Size Range | Supports conventional small-to-medium die; exact limits depend on configuration |
| Dispensing System | Time-pressure / screw pump / jet valve (depending on configuration) |
| Vision System | Embedded alignment recognition with real-time error correction |
| Operation Mode | Fully automatic, supports extended unattended operation |
The above parameters are for reference as capability boundaries and are not intended as acceptance criteria. Actual accuracy and throughput of a used machine depend on the condition of the motion platform, vision system calibration, and the actual wear on the dispensing system.
Four Core Function Modules
The AD8312Plus's engineering approach to epoxy die bonding is concentrated in four built-in process control modules. Each addresses a specific production pain point:
iDispense — Epoxy Tail Control
Silver epoxy dispensing at high speed tends to produce stringing or tailing, which directly affects the fillet height at the die edge and subsequent reliability. iDispense intervenes at the final stage of the dispensing action, reducing edge coverage variation caused by inconsistent epoxy volume.
iSense — Real-Time Fluid Level Measurement
Changes in epoxy level within the syringe affect dispensing consistency, especially during prolonged continuous production. iSense turns "epoxy volume drift" from a manual inspection concern into a closed-loop control handled by the equipment itself.
iTouch — Contact Force Management
Thin die are prone to micro-cracking during the die attach compression stage, or epoxy may be over-compressed and overflow. iTouch keeps downward force within the "just enough wetting" window, reducing dependence on operator experience.
iBalance — Vibration Suppression
Vibration generated by the XY platform during high-speed reciprocation is a hidden killer of placement accuracy. iBalance suppresses vibration transmission at the mechanical level, ensuring placement consistency for every die on a high-density leadframe.
Individually, none of these modules represents cutting-edge technology. Combined, they form a process control system suited for stable, long-duration epoxy die bonding operation.
Key Items to Verify When Buying Used
The actual output capability of a used machine depends on several factors more important than the year of manufacture:
Whether XY platform repeat positioning accuracy is still within specification
Actual operating hours of the dispensing system (not just equipment power-on hours)
Worktable wear condition, especially fixture locating surfaces
Vision system calibration status, including camera and light source aging
Specific configuration differences: dispensing valve type, feeder configuration, software version
We recommend requesting a live running video or arranging an on-site inspection before purchase, focusing on placement consistency and dispensing volume stability during continuous operation.
