The PVA TePla / Technics 600 automated RF plasma cleaning system is ideally suited for processing 6-inch wafers. Capable of removing photoresist residues following photolithography and etching steps, the system utilizes an automated wafer handling unit and a controllable RF plasma source to perform gentle, uniform ashing without damaging delicate underlying thin-film layers. Its adjustable oxygen-based plasma process effectively removes organic residues while ensuring extremely low levels of surface contamination.
Thanks to its simple and robust design, this pre-owned system is easy to maintain. It offers a cost-effective solution for wafer fabs requiring reliable photoresist removal capabilities in front-end processing.
PVA TePla 600 Autoload Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | 600 Autoload / 600-AL |
| Equipment Type | Semi-Automatic RF Plasma Asher and Etching System |
| Maximum Wafer Size | Up to 200 mm, according to the matching equipment configuration |
| RF Frequency | 13.56 MHz |
| RF Generator | ENI RF generator |
| RF Power | 0–600 W |
| Process Chamber Material | Ceramic |
| Chamber Diameter | 245 mm |
| Chamber Depth | 380 mm |
| Process Gas Channels | Four MFC-controlled gas channels, according to the matching equipment configuration |
| Vacuum Pump | Leybold TRIVAC D65-series vacuum pump; exact model suffix to be confirmed |
| Recorded Operating Hours | 1,731 hours, according to the available equipment listing |
| Electrical Supply | 230 V, 50/60 Hz; current and power rating should be confirmed from the machine nameplate |
| Approximate System Dimensions | 740 × 624 × 701 mm, excluding external connections and vacuum equipment |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
