Designed for batch photoresist stripping, the PVA TePla / Technics 600 is an automated RF plasma asher well-suited for 6-inch wafer processing. It removes exposed photoresist residues after lithography and etch steps, commonly used within discrete and power semiconductor manufacturing flows.
Equipped with autoload wafer handling and controllable RF plasma source, the system achieves gentle, uniform resist ash without damaging delicate underlying thin films. Adjustable oxygen-based plasma chemistry effectively clear organic residues while keeping wafer surface contamination low.
Thanks to its simple, robust chamber construction, this pre-owned tool is easy to service and maintain. It offers a cost-effective solution for fabs needing dependable resist stripping capacity to complete their front-end process sequence.
PVA TePla 600 Autoload Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | 600 Autoload / 600-AL |
| Equipment Type | Semi-Automatic RF Plasma Asher and Etching System |
| Maximum Wafer Size | Up to 200 mm, according to the matching equipment configuration |
| RF Frequency | 13.56 MHz |
| RF Generator | ENI RF generator |
| RF Power | 0–600 W |
| Process Chamber Material | Ceramic |
| Chamber Diameter | 245 mm |
| Chamber Depth | 380 mm |
| Process Gas Channels | Four MFC-controlled gas channels, according to the matching equipment configuration |
| Vacuum Pump | Leybold TRIVAC D65-series vacuum pump; exact model suffix to be confirmed |
| Recorded Operating Hours | 1,731 hours, according to the available equipment listing |
| Electrical Supply | 230 V, 50/60 Hz; current and power rating should be confirmed from the machine nameplate |
| Approximate System Dimensions | 740 × 624 × 701 mm, excluding external connections and vacuum equipment |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
