The PVA TePla / Technics GIGA 690 brings batch microwave plasma processing to 6-inch wafer production, including power semiconductors and discrete devices. Photoresist removal and post-process polymer cleaning are among its key applications, particularly where wafer surfaces must be cleaned before the next manufacturing step.
Its electrode-free plasma source avoids direct electrode contact with the process environment, helping limit metal contamination. Oxygen plasma breaks down organic residues, while gas composition and process conditions influence removal rates and their effect on underlying films.
For used GIGA 690 equipment, the main purchasing considerations are chamber condition, batch loading capacity, plasma control performance and maintenance records. Confirming the installed configuration and availability of replacement components can help determine whether the machine fits the intended production line.
PVA TePla GIGA 690 Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | GIGA 690 |
| Equipment Type | Low-Pressure Microwave Plasma Cleaning and Activation System |
| Equipment Year | 2010, according to the available equipment listing |
| Process Chamber Material | Aluminum |
| Chamber Volume | 91 L |
| Chamber Inner Dimensions | 450 × 450 × 450 mm |
| Plasma Frequency | 2.45 GHz |
| Microwave Power | 0–1,000 W |
| Standard Gas Channels | Two channels, each with a mass flow controller and solenoid valve |
| Vacuum Connection | DN 63 ISO K |
| Base Pressure | Approximately 2 × 10-2 mbar |
| Process Pressure | Approximately 0.2–2 mbar |
| Evacuation Time | Approximately 1 minute |
| System Control | PC-based controller with 10.4-inch graphical display |
| Operating System | QNX real-time operating system |
| Electrical Supply | 230 V, single-phase, 15 A, 50/60 Hz |
| Process Gas Supply | 1/4-inch Swagelok connection, 1–2 bar input pressure |
| Compressed Air Supply | 1/4-inch Swagelok connection, 4–6 bar input pressure |
| Approximate Dimensions | 1,050 × 1,750 × 800 mm |
| Approximate Weight | 195 kg, system only and excluding the vacuum pump |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |
