HOME > Products > Front-End Wafer Fab Equipment > Semiconductor Etch Equipment >

Used PVA TePla / Technics GIGA 690 Microwave Plasma System

Used 2010 PVA TePla / Technics GIGA 690 microwave plasma system for semiconductor package cleaning and surface activation. Ask for condition and options.

Used PVA TePla / Technics GIGA 690 Microwave Plasma System EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The GIGA 690 from PVA TePla / Technics leverages microwave plasma technology, separating it from conventional RF plasma tools. Primarily deployed for high-volume photoresist stripping and wafer surface treatment, this batch system handles 6-inch wafers widely in power semiconductor and discrete device factories.

With electrode-free plasma generation, it avoids metallic contamination. Carefully regulated oxygen chemistry enables fast yet gentle organic ashing, preserving sensitive thin films and device structures while clearing resist and polymer residues efficiently.

Its high-throughput batch chamber design maximizes wafer capacity per run. As a well-established second-hand platform, spare parts remain available, bringing reliable plasma processing capability at a competitive investment for expanding fab production lines.

PVA TePla GIGA 690 microwave plasma system

PVA TePla GIGA 690 Main Specifications

ManufacturerPVA TePla / Technics
ModelGIGA 690
Equipment TypeLow-Pressure Microwave Plasma Cleaning and Activation System
Equipment Year2010, according to the available equipment listing
Process Chamber MaterialAluminum
Chamber Volume91 L
Chamber Inner Dimensions450 × 450 × 450 mm
Plasma Frequency2.45 GHz
Microwave Power0–1,000 W
Standard Gas ChannelsTwo channels, each with a mass flow controller and solenoid valve
Vacuum ConnectionDN 63 ISO K
Base PressureApproximately 2 × 10-2 mbar
Process PressureApproximately 0.2–2 mbar
Evacuation TimeApproximately 1 minute
System ControlPC-based controller with 10.4-inch graphical display
Operating SystemQNX real-time operating system
Electrical Supply230 V, single-phase, 15 A, 50/60 Hz
Process Gas Supply1/4-inch Swagelok connection, 1–2 bar input pressure
Compressed Air Supply1/4-inch Swagelok connection, 4–6 bar input pressure
Approximate Dimensions1,050 × 1,750 × 800 mm
Approximate Weight195 kg, system only and excluding the vacuum pump
ConditionUsed semiconductor equipment
AvailabilitySubject to current stock, inspection and configuration confirmation

PVA TePla GIGA 690 plasma process chamber

PVA TePla GIGA 690 equipment nameplate