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Used PVA TePla / Technics GIGAbatch 360M Plasma Asher

Used PVA TePla / Technics GIGAbatch 360M microwave plasma asher for batch photoresist stripping and wafer cleaning. Ask for condition and configuration.

Used PVA TePla / Technics GIGAbatch 360M Plasma Asher EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
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Technical RFQ Package and process matching

The PVA TePla / Technics GIGAbatch 360M is a high-performance batch microwave plasma asher engineered for standardized semiconductor front-end processing. Tailored for 150mm–200mm wafer mass production, it specializes in high-efficiency photoresist stripping, polymer residue removal and wafer surface activation for power devices and discrete semiconductors.

Adopting electrodeless 2.45GHz microwave plasma technology, the system generates high-density reactive radicals without electrode contamination. This damage-free plasma processing delivers uniform ashing performance across the entire wafer batch, effectively eliminating organic residues while preserving delicate thin-film structures and device integrity.

Featuring a cleanroom-certified compact layout and large-capacity chamber design, the tool supports high-volume batch processing with outstanding process repeatability. Its fully tunable gas delivery and pressure control system accommodates diverse process recipes. With low operational costs and stable long-term runtime performance, it serves as a core plasma processing solution for mature-node semiconductor production lines.

PVA TePla GIGAbatch 360M plasma asher

PVA TePla GIGAbatch 360M Main Specifications

ManufacturerPVA TePla / Technics
ModelGIGAbatch 360M
Equipment TypeMicrowave Plasma Batch Asher and Wafer Cleaning System
Plasma Frequency2.45 GHz
Microwave Power0–1,000 W
Vacuum Chamber MaterialQuartz
Chamber Diameter245 mm
Chamber Depth395 mm
Chamber Volume18 L
Wafer CapacityUp to 50 wafers with a diameter of 150 mm, depending on the installed wafer carrier
Process Gas ControlTwo MFC-controlled gas lines in the base platform configuration
Process MonitoringWafer temperature monitoring and endpoint detection in the base platform configuration
Electrical Connection230 V, 15 A, 50/60 Hz
Approximate Dimensions795 × 1,540 × 710 mm
Approximate Weight190 kg
Equipment Year2013, according to the available equipment listing
ConditionUsed semiconductor equipment
AvailabilitySubject to current stock, inspection and configuration confirmation

GIGAbatch 360M microwave plasma process chamber

PVA TePla GIGAbatch 360M equipment nameplate