The PVA TePla / Technics GIGAbatch 360M is a high-performance batch microwave plasma asher engineered for standardized semiconductor front-end processing. Tailored for 150mm–200mm wafer mass production, it specializes in high-efficiency photoresist stripping, polymer residue removal and wafer surface activation for power devices and discrete semiconductors.
Adopting electrodeless 2.45GHz microwave plasma technology, the system generates high-density reactive radicals without electrode contamination. This damage-free plasma processing delivers uniform ashing performance across the entire wafer batch, effectively eliminating organic residues while preserving delicate thin-film structures and device integrity.
Featuring a cleanroom-certified compact layout and large-capacity chamber design, the tool supports high-volume batch processing with outstanding process repeatability. Its fully tunable gas delivery and pressure control system accommodates diverse process recipes. With low operational costs and stable long-term runtime performance, it serves as a core plasma processing solution for mature-node semiconductor production lines.

PVA TePla GIGAbatch 360M Main Specifications
| Manufacturer | PVA TePla / Technics |
|---|---|
| Model | GIGAbatch 360M |
| Equipment Type | Microwave Plasma Batch Asher and Wafer Cleaning System |
| Plasma Frequency | 2.45 GHz |
| Microwave Power | 0–1,000 W |
| Vacuum Chamber Material | Quartz |
| Chamber Diameter | 245 mm |
| Chamber Depth | 395 mm |
| Chamber Volume | 18 L |
| Wafer Capacity | Up to 50 wafers with a diameter of 150 mm, depending on the installed wafer carrier |
| Process Gas Control | Two MFC-controlled gas lines in the base platform configuration |
| Process Monitoring | Wafer temperature monitoring and endpoint detection in the base platform configuration |
| Electrical Connection | 230 V, 15 A, 50/60 Hz |
| Approximate Dimensions | 795 × 1,540 × 710 mm |
| Approximate Weight | 190 kg |
| Equipment Year | 2013, according to the available equipment listing |
| Condition | Used semiconductor equipment |
| Availability | Subject to current stock, inspection and configuration confirmation |

