The PVA TePla IoN 200 delivers controlled plasma treatment for semiconductor substrates, removing organic residues and surface contaminants through low-damage plasma cleaning. It handles wafers, compound materials and packaged dies without harsh wet chemistry, ideal for pre-bonding and pre-deposition surface preparation steps.
Its compact chamber design pairs with tunable power and gas control to maintain uniform plasma distribution across the sample surface. Operators can quickly adjust process recipes for different materials, while robust hardware keeps maintenance simple for continuous workshop runs.
PVA TePla IoN 200 Machine Information
| Manufacturer | PVA TePla |
|---|---|
| Model | IoN 200 |
| Equipment Type | Vacuum RF plasma processing system |
| Primary Applications | Surface cleaning, activation and modification |
| Processing Environment | Low-pressure plasma treatment |
| Typical Workpieces | Compatible substrates, wafers, electronic components and industrial parts |
| Additional Process Capability | PECVD-related applications according to the installed system configuration |
| Condition | Pre-owned plasma processing equipment |
| Actual Configuration | Confirmed according to the specific system available |
| Delivery Scope | Based on the quotation and confirmed equipment list |
| Support | Initial fault review, component matching and repair discussion |
| Shipping | Export packing and worldwide delivery |
