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DISCO DAD323 Automatic Dicing Saw | 6-Inch Dicer with

single-spindle dicing saw with 2.0 kW high-torque spindle for Φ6-inch wafers. Only 490mm wide. Handles glass, ceramics, and difficult-to-cut materials. Optional 60,000 rpm 1.8 kW spindle available.

DISCO DAD323 Automatic Dicing Saw | 6-Inch Dicer with EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The DISCO DAD323 is a compact, automatic single-axis dicing saw equipped with a standard 2.0 kW high-torque spindle, providing ample power for cutting glass, ceramics, and other hard-to-cut materials. With a width of only 490 mm, it significantly boosts productivity per unit of floor space when multiple machines are arranged side-by-side.

Key features of the DISCO DAD323 automatic dicing saw:

  • High-Torque 2.0 kW Spindle: The standard 2.0 kW spindle (40,000 min⁻¹) with 0.48 N·m rated torque provides ample power for cutting glass, ceramics, and other difficult-to-cut materials. A high-speed 1.8 kW spindle (max 60,000 min⁻¹) is available as an option for applications requiring higher RPM.

  • World's Smallest Footprint: At just 490mm wide, the DAD323 dramatically increases productivity per unit area, especially when multiple machines are arranged side by side in a production line.

  • Y-Axis Scale Specification (Optional): Enables high-precision index control for demanding dicing street requirements. Index positioning accuracy of 0.005/160mm (single error).

  • High Productivity: High-performance MCU improves software operation and response speed. X-axis speed of 800 mm/s, Y-axis 200 mm/s, Z-axis 80 mm/s — a significant increase over the previous DAD322 model.

Equipped with high-precision vision alignment, the system identifies cutting streets automatically and maintains tight kerf positioning accuracy. The optional Y-axis scale upgrade further boosts index control for challenging brittle substrates, effectively minimizing chipping during high-speed singulation. Its fast X-axis traverse speed optimizes cycle time without sacrificing cutting quality.

DISCO DAD323 automatic semiconductor wafer dicing saw

DISCO DAD323 Machine Information

ManufacturerDISCO
ModelDAD323
Equipment TypeAutomatic single-spindle dicing saw
Maximum Workpiece SizeUp to Φ6 inches; 150 × 150 mm square workpieces require the applicable user-specified configuration
X-Axis Cutting Range160 mm
Y-Axis Cutting Range162 mm
Standard Spindle2.0 kW at 40,000 min⁻¹
Standard Spindle Speed3,000–40,000 min⁻¹
Optional Spindle1.8 kW high-speed spindle with a maximum speed of 60,000 min⁻¹
AlignmentAutomatic alignment included in the manufacturer’s standard model specification
Machine DimensionsApproximately 490 × 870 × 1,600 mm
Machine WeightApproximately 400 kg
Production StatusDiscontinued by the manufacturer; DAD324 is listed as the successor model
ConditionPre-owned precision dicing equipment
Delivery ScopeBased on the quotation and confirmed equipment list
ShippingExport packing and worldwide delivery