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DISCO DAD323 Dicing Saw

DISCO DAD323 blade dicing saw for wafer and substrate singulation. Review lifecycle status, machine checks, process inputs and parts support.

DISCO DAD323 Dicing Saw EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The DISCO DAD323 is a compact single-spindle automatic dicing saw, built to handle substrates up to 6-inch square. It features a 2.0kW high-torque spindle delivering rotational speeds from 3,000 to 40,000 rpm, making it suitable for slicing silicon wafers, glass and hard ceramic materials.

Equipped with high-precision vision alignment, the system identifies cutting streets automatically and maintains tight kerf positioning accuracy. The optional Y-axis scale upgrade further boosts index control for challenging brittle substrates, effectively minimizing chipping during high-speed singulation. Its fast X-axis traverse speed optimizes cycle time without sacrificing cutting quality.

DISCO DAD323 automatic semiconductor wafer dicing saw

DISCO DAD323 Machine Information

ManufacturerDISCO
ModelDAD323
Equipment TypeAutomatic single-spindle dicing saw
Maximum Workpiece SizeUp to Φ6 inches; 150 × 150 mm square workpieces require the applicable user-specified configuration
X-Axis Cutting Range160 mm
Y-Axis Cutting Range162 mm
Standard Spindle2.0 kW at 40,000 min⁻¹
Standard Spindle Speed3,000–40,000 min⁻¹
Optional Spindle1.8 kW high-speed spindle with a maximum speed of 60,000 min⁻¹
AlignmentAutomatic alignment included in the manufacturer’s standard model specification
Machine DimensionsApproximately 490 × 870 × 1,600 mm
Machine WeightApproximately 400 kg
Production StatusDiscontinued by the manufacturer; DAD324 is listed as the successor model
ConditionPre-owned precision dicing equipment
Delivery ScopeBased on the quotation and confirmed equipment list
ShippingExport packing and worldwide delivery