The ASMPT AD420XL Mini LED Die Bonder is capable of mounting Mini LED chips onto large-format substrates with high speed and precision. Supporting substrate sizes up to 500mm × 600mm, it accommodates applications ranging from large LCD backlight modules to fine-pitch RGB direct-view panels. Its broad chip compatibility—handling sizes as small as 2 × 4 mil—ensures continued production value during the industry's transition from Mini LED to Micro LED technology.
In terms of throughput, the die-bonding cycle time is approximately 102ms at a 6mm pitch, meeting the requirements for mass production pacing. Regarding precision, rotational deviation is controlled within ±1° (3σ) and placement accuracy is ±15μm (3σ), sufficient to meet the chip-spacing requirements for P0.4 fine-pitch displays. Although this model has largely been superseded by newer platforms in the new equipment market and availability in the secondary market is limited, it remains a viable option for production lines seeking to rapidly expand Mini LED COB capacity or minimize equipment investment costs.
Machine Specifications
| Item | Description |
|---|---|
| Machine Model | ASMPT AD420XL Mini LED Die Bonder |
| Condition | Used / Refurbished, fully rebuilt and pre-production validated |
| Primary Process | Mini LED COB die attach |
| Substrate Types | Glass, PCB panel |
| Max Panel Dimension | 500 mm × 600 mm |
| Vision System | Multi-camera, pre & post bond inspection, XYθ real-time correction |
| Base Construction | Granite base for vibration stability |
| Target Application | Mini LED BLU local dimming, fine-pitch RGB direct display |
| Control System | Graphical HMI, recipe storage, production & error logging |
| Refurbishment Workflow | Mechanical disassembly & deep clean, motion component replacement, vision optical calibration, vacuum/nozzle overhaul, dry run and bonding simulation |
| Handover Deliverables | Performance test report, replaced parts list, operation manual |
Note: Placement accuracy, UPH and minimum chip pitch depend on chip size, substrate flatness and nozzle configuration. Contact us for process-specific test data.
Why Choose Refurbished AD420XL For Mini LED Production
Many standard die bonders struggle with large, flexible COB substrates, but the AD420XL was purpose-built for this exact application. Its granite base and dual inspection vision reduce yield loss caused by vibration or panel warpage.
Used AD420XL units remain well-supported in the optoelectronics equipment market. Spare parts and process expertise are accessible, keeping long-term maintenance downtime low. For display factories, a certified refurbished unit delivers:
Major CAPEX savings compared with new panel-level die attach equipment
Fast delivery timeline for quick capacity ramp
Pre-shipment bonding validation, not just idle dry-run testing
Optional on-site installation guidance and operator training
Full transparency on machine condition and replaced components
12+ months of warranty and continuous after-sales technical suppor
FAQ
Is this ASMPT AD420XL new or pre-owned?
This is a used ASMPT AD420XL Mini LED die bonder, fully refurbished, calibrated and tested. Not sold as-is.
What substrates can the AD420XL process?
It supports glass and PCB panels up to 500×600 mm, designed for COB Mini LED assembly.
What makes AD420XL different from regular semiconductor die bonders?
It uses a granite anti-vibration base and integrated pre/post bond vision inspection, optimized specifically for large COB panels and tiny Mini LED chips.
Does it include placement inspection?
Yes. The multi-camera system checks chip orientation before bonding and verifies placement after bonding.
What after-sales warranty do you provide?
Our refurbished ASMPT AD420XL is backed by 12+ months warranty. Remote technical support and covered spare parts support are included within warranty term, with long-term spare part availability post-warranty.
Can you ship globally?
Yes. We provide export crating, packing and required documentation for worldwide shipment of optoelectronic equipment.
