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Used ASMPT AD420XL Mini LED Die Bonder

Used ASMPT AD420XL automatic Mini LED die bonder for COB backlights and fine-pitch RGB displays. Check specifications, configuration, condition, price and availability.

Used ASMPT AD420XL Mini LED Die Bonder EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

The ASMPT AD420XL is an automatic die bonder developed for high-density Mini LED chip placement. The machine is used to pick individual LED dies, correct their position and orientation through the vision system, and place them onto the programmed locations on a substrate.

Typical applications include Mini LED COB backlights, local-dimming backlight modules and fine-pitch RGB direct-view LED displays. It is a chip placement machine and should not be described as LCD or OLED panel lamination equipment.

The AD420XL can handle large substrates and closely spaced LED arrays. The actual production capability of a used machine depends on its installed die handling system, bond head, vision system, substrate transport, tooling and software version.

ASMPT AD420XL Specifications

ManufacturerASMPT
ModelAD420XL
Equipment TypeAutomatic Mini LED die bonder
ProcessLED die pick, vision alignment and placement
Die Bond Cycle102 ms at 6 mm pitch*
Maximum Substrate SizeUp to 500 × 600 mm*
Minimum Chip GapDown to 20 µm*
RGB Display PitchDown to P0.4*
Small Die HandlingLED chips down to 2 × 4 mil*
Production ConfigurationInline or offline, depending on the installed machine configuration

*Published platform values. Actual performance depends on the machine configuration, tooling, material and production process.

Applications

The ASMPT AD420XL is mainly used for the following products:

  • Mini LED COB backlight modules

  • Local-dimming LCD backlight modules

  • Fine-pitch RGB direct-view LED displays

  • High-density Mini LED arrays

  • Large-format LED substrates and panels

Backlight and RGB display production may require different die handling, tooling, lighting and software configurations. The intended product and chip dimensions should therefore be checked against the configuration of the available machine.

Used Machine Configuration and Condition

Used ASMPT AD420XL machines may differ in year, die source, bond head, camera system, substrate transport and included tooling. Before quotation, we provide the available machine’s nameplate and configuration details.

Year of ManufactureProvided with the available machine
Serial NumberProvided before order confirmation
Original ApplicationBacklight or RGB display configuration, depending on the machine
Production ModeInline or offline configuration
Die Handling SystemConfirmed from the installed machine
Bond Head and ToolingConfirmed from the installed machine
Vision SystemCameras, lenses and lighting listed with the machine configuration
Substrate HandlingTransport direction and supported substrate size confirmed before quotation
SoftwareInstalled software version and available production recipes confirmed with the machine
Included ItemsTooling, fixtures, accessories and spare parts listed separately

The machine may be supplied as-is, powered-on tested or refurbished, depending on the available unit. Test photos, operating videos and inspection records can be provided when available.

Availability and Price

AvailabilitySubject to current inventory
ConditionUsed, tested or refurbished depending on the available machine
PriceQuotation based on year, configuration, condition and included accessories
Machine EvidenceNameplate photos, configuration list and machine photos available before purchase
Export PackingAvailable for international shipment
International DeliveryAvailable subject to destination and export requirements

For a quotation, please provide the LED chip size, substrate dimensions, target pitch, required production mode and delivery country. We will confirm whether the available AD420XL configuration is suitable before quoting.