The MRSI-705 die bonder features a granite base that effectively suppresses vibration and thermal drift, ensuring sub-micron placement stability during eutectic bonding and epoxy die attach processes.
The system supports the assembly of flip chips, multi-chip modules (MCMs), sensors, and laser diodes. Its multi-station nozzle changer enables rapid nozzle swaps, allowing for transitions between different die sizes and process programs without significant downtime. Compatible with various input formats—including wafers, Gel-Paks, Waffle Packs, and custom trays—the system offers adjustable bonding force, making it suitable for both fragile optical chips and robust power components.
Every pre-owned MRSI-705 in our inventory undergoes comprehensive mechanical inspection, axis calibration, vision alignment, and functional testing prior to shipment. We conduct bonding consistency tests and verify linear motor and software performance to minimize your production risks. This system is ideal for NPI (New Product Introduction), low-volume pilot runs, and mid-scale production in sectors such as optical transceivers, LiDAR, RF, MEMS, and medical sensor packaging.
Please contact us to request equipment configuration records, test reports, and information on optional accessories. We invite you to reach out to confirm stock availability, tooling options, and lead times tailored to your assembly process.
Overview of Core Technologies for the MRSI-705 Die Bonder
| Core Technology | Description |
|---|---|
| Granite Mechanical Platform | Minimizes vibration and thermal drift, maintains consistent sub-micron placement accuracy during long bonding cycles |
| Closed-Loop Linear Motor Drive | Delivers fast, repeatable motion control; supports fine tuning for delicate optical die assembly |
| Multi-Station Tool Changer | Automatic collet swapping, reduces recipe switch downtime for mixed die size production |
| High-Resolution Vision Alignment | Precise pattern recognition for eutectic bonding and flip chip alignment requirements |
| Programmable Bond Force Control | Flexible force tuning, protects thin, fragile photonics and MEMS components from damage |
| Multi-Mode Bonding Support | Handles both epoxy die attach and eutectic bonding on the same platform |