The ASM MS60 sorts chips according to wafer map data, linking each die’s recorded position and classification to the sorting process. This map-based workflow carries upstream classification results into chip handling, preparing sorted dies for subsequent production steps.
For LED chip production, map compatibility and material handling are central to the equipment configuration. Die dimensions, wafer orientation and the receiving arrangement need to match the installed software and tooling.
The machine features an enclosed working area with a front viewing window, allowing operators to observe the sorting mechanism while the cover remains closed. The monitor and front control panel keep the operating interface, pressure gauges and emergency stop within easy reach.
ASM MS60 Product Highlights
| Feature | Description |
|---|---|
| Map-Based Sorting | Follows die positions and classifications recorded in wafer map data. |
| Classification Workflow | Connects upstream classification data with the physical chip sorting process. |
| Enclosed Working Area | Houses the sorting mechanism inside the machine enclosure. |
| Front Viewing Window | Allows observation of the working area with the front cover closed. |
| Accessible Controls | Positions the monitor, pressure gauges and emergency stop at the front of the machine. |
We supply ASM MS60 equipment and review each machine’s configuration against your chip sorting requirements. Contact us with your chip dimensions, wafer frame details and a sample map file to discuss configuration and request a quotation.
