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TEL P-8 200mm (8-Inch) Fully Automatic Wafer Prober

Source tested and refurbished TEL P-8 8-inch automatic wafer probers. Full mechanical inspection, chuck planarity calibration, and tester docking options. Request an RFQ.

  • Brand Tokyo Electron (TEL)
  • Wafer Size 150 mm (6-inch) 200 mm (8-inch)
  • Model TEL P-8
  • Condition Refurbished / Fully Tested / Production-Ready
  • Availability In Stock at GK-SEMI (Ready for Global Shipping)
TEL P-8 200mm (8-Inch) Fully Automatic Wafer Prober EQUIPMENT IMAGE
Configuration Review Model and installed options
New / Used Supply Subject to project availability
Global Delivery Destination-based assessment
Technical RFQ Package and process matching

Why Choose the TEL P-8 for 200mm Wafer Testing?

The TEL P-8, manufactured by Tokyo Electron (TEL), is an established automatic wafer probing platform used in mature semiconductor manufacturing and testing applications.

For facilities operating 150mm and 200mm production lines, purchasing a pre-owned TEL P-8 can be a practical alternative to investing in new equipment, particularly when maintaining compatibility with existing test programs, probe cards and production infrastructure is a priority.

The platform may be suitable for wafer-level testing applications involving power devices, analog and mixed-signal ICs, discrete semiconductors and other mature semiconductor technologies, subject to the installed configuration and process requirements.

TEL P-8 200mm Automatic Wafer Prober

Key Advantages

Established Mechanical Platform

The TEL P-8 uses a precision motion system designed for automated wafer positioning and probing. Stage accuracy and repeatability should be confirmed through inspection and calibration of the individual machine.

Integration with Existing Test Systems

The equipment can be evaluated for integration with ATE systems from manufacturers such as Teradyne, Advantest, Credence and other suppliers. Actual compatibility depends on the tester interface, docking arrangement, control software and probe card configuration.

Spare Parts and Maintenance Support

Replacement components and maintenance services may be available for mechanical assemblies, control boards, motors, optical systems, vacuum components and related subsystems. Parts availability is confirmed against the machine version and component part numbers.

Cost-Effective Capacity Expansion

A properly inspected pre-owned TEL P-8 may help reduce equipment acquisition costs when expanding mature-node wafer test capacity or replacing an existing prober.

TEL P-8 Wafer Prober

TEL P-8 Technical Specifications

The following specifications describe general platform capabilities and possible configurations. Exact specifications must be verified against the available machine.

ManufacturerTokyo Electron (TEL)
ModelTEL P-8
Equipment TypeAutomatic Wafer Prober
Wafer Size150mm / 200mm, subject to machine configuration
Wafer LoadingAutomatic wafer handling; cassette and transfer configuration to be confirmed
X/Y StagePrecision automated wafer positioning system
Z-AxisProgrammable vertical movement and probe contact control
Theta AlignmentWafer rotational alignment; actual adjustment range to be verified
Vision SystemOptical wafer alignment and pattern recognition, depending on installed hardware
Chuck TemperatureAmbient or optional temperature-controlled configuration; operating range to be confirmed
ATE InterfaceDepends on installed controller, interface boards and software
Probe Card InterfaceProbe card holder and docking configuration to be confirmed
Equipment ConditionAs-Is / Tested / Refurbished options

Equipment Inspection and Refurbishment Services

GK-SEMI / Xinling provides equipment inspection, configuration verification and refurbishment support according to the condition of the available TEL P-8 and the customer's requirements.

The following inspection and servicing items can be discussed before quotation. The final scope depends on the purchased condition grade and agreed acceptance criteria.

1. Stage Calibration and Motion Verification

  • Inspect X, Y and Z motion assemblies for mechanical wear and abnormal movement.

  • Clean and lubricate applicable guideways and mechanical transmission components.

  • Check stage positioning, alignment and repeatability.

  • Verify travel limits, homing operations and relevant sensors.

2. Chuck and Temperature System Inspection

  • Inspect wafer chuck surface condition and mounting stability.

  • Check chuck vacuum hold-down performance.

  • Verify chuck movement and applicable leveling adjustments.

  • Test temperature control functions when a thermal chuck is installed.

3. Optical Alignment and Pattern Recognition

  • Inspect camera, lens and illumination assemblies.

  • Check image clarity, focus and lighting performance.

  • Verify wafer alignment and pattern recognition functions where supported.

  • Evaluate alignment operation using suitable test wafers when available.

4. Pneumatic and Vacuum System Inspection

  • Inspect pneumatic tubing, seals, fittings and vacuum connections.

  • Check vacuum valves and related control components.

  • Verify wafer handling and chuck vacuum functions.

  • Replace damaged or deteriorated components where included in the refurbishment scope.

5. Electrical and Control System Verification

  • Inspect power supplies, control boards and electrical connections.

  • Check emergency stop functions and safety interlocks.

  • Verify controller startup and machine initialization.

  • Test available communication interfaces against the customer's ATE requirements.

  • Conduct functional cycling or extended running tests when agreed and technically feasible.

Available Customization and Retrofit Options

Depending on the machine configuration and technical feasibility, GK-SEMI can assist with selected modifications to support existing semiconductor test operations.

Display and Operator Interface Upgrades

Legacy display components may be evaluated for replacement or modernization. Compatibility with the original controller and video interface must be verified before modification.

Data Storage Modernization

For systems using legacy storage media, compatible solid-state storage or floppy drive emulation solutions may be considered to simplify program storage and backup.

ATE Tester Docking and Interface Support

We can evaluate mechanical docking arrangements, tester interface requirements, probe card mounting and related connection components according to the customer's existing ATE platform.

Special Wafer and Substrate Handling

Handling modifications for thin wafers, special substrates or non-standard wafer configurations may be evaluated on a project basis. Feasibility depends on the transfer mechanism, chuck design and substrate characteristics.

What to Confirm Before Purchasing a TEL P-8

To recommend an appropriate configuration and provide an accurate quotation, please share the following information with our equipment team.

Wafer Specifications

  • Wafer diameter: 150mm or 200mm

  • Wafer thickness and substrate material

  • Backside metallization or special surface requirements

  • Any special wafer handling requirements

Test Conditions

  • Required test temperature range

  • Probe contact and overdrive requirements

  • Required positioning accuracy and repeatability

  • Wafer alignment and pattern recognition requirements

Tester and Probe Card Configuration

  • ATE manufacturer and model

  • Probe card dimensions and interface type

  • Existing tester docking and manipulator arrangement

  • Required communication interfaces

Factory Utilities

  • Available power supply voltage and frequency

  • Compressed dry air requirements

  • Available vacuum supply

  • Installation space and cleanroom requirements

TEL P-8 Equipment Supply and Worldwide Delivery

GK-SEMI / Xinling supplies pre-owned semiconductor equipment to customers worldwide. We support equipment sourcing, configuration checking, inspection coordination, spare parts requirements and international shipment arrangements.

Available TEL P-8 machines may differ in production year, controller version, wafer handling accessories, chuck type and installed interface hardware.

Before confirming an order, our team can help verify the equipment configuration against your intended application and discuss the available inspection documentation, delivery condition and acceptance requirements.

Export packing, moisture protection and protective wooden crating can be arranged according to equipment dimensions, shipping method and customer requirements.

Request a TEL P-8 Quotation

Looking for a TEL P-8 200mm automatic wafer prober for your semiconductor production line, equipment replacement project or R&D facility?

Contact GK-SEMI / Xinling to discuss machine availability, condition options, compatible configurations and delivery arrangements.

Depending on the available equipment and agreed inspection scope, we can provide machine photographs, configuration information, functional test videos and inspection documentation.

Equipment: TEL P-8 Automatic Wafer Prober

Wafer Size: 150mm / 200mm

Supply: Pre-Owned / Inspected / Refurbished

Shipping: Worldwide

Send us your wafer size, tester model and required equipment configuration to receive a tailored quotation.