Besi Esec 2100 FC hS Flip Chip Bonder

The Besi Esec 2100 FC hS high-speed flip chip bonder picks dies from wafers or waffle packs. It applies flux via a slide dip system and places dies on lead frames or laminated substrates after bump alignment verification. The process starts with tack bonding, and final electrical connections form in the subsequent reflow step.

In high-precision mode, placement accuracy reaches 8 µm @ 3σ, with throughput up to 12,000 UPH. This rate includes flux dipping and full post-bond inspection. Targeted for cost-sensitive high-volume manufacturing, the 8 µm accuracy meets production requirements, where uptime carries greater weight than sub-micron precision.

The platform uses the Phi-Y motion concept, combining rotational alignment and Y-axis travel in one synchronized movement. Dies and cameras move independently with a patented sliding flux unit, so flux dipping and bump alignment run in parallel instead of sequentially. Pseudo X-ray alignment aids accurate positioning of the first die and eliminates iterative trial runs. Process monitoring covers automatic flux mark inspection and real-time contact detection to flag cold joints and poor wetting during the bonding cycle.

The 2100 FC hS handles die sizes from 0.2 mm (with small die kit) to 20 mm. It supports 4-inch to 12-inch wafers and 6/8/12-inch lead frames. Often paired with the SDH-84fc substrate handler for strip-format parts. Typical applications include FCCSP, FCBGA, FC-SIP, FC-MIS, FCOL and emerging packages such as CSP-LED.

Because the platform has been discontinued for years but still circulates actively on the secondary market, used units vary significantly in installed options, bond head condition, and software version. 

Key Specifications of the Besi Esec 2100 FC hS Flip-Chip Bonder